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參數(shù)資料
| 型號： | FC30TR |
| 廠商： | STMICROELECTRONICS |
| 元件分類： | 模擬信號調理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PBGA14 |
| 封裝： | 5 X 3 MM, 0.92 MM HEIGHT, 0.80 MM PITCH, GREEN, LGA-14 |
| 文件頁數(shù)： | 2/13頁 |
| 文件大?。?/td> | 181K |
| 代理商： | FC30TR |
Application hints
FC30
10/13
Doc ID 14752 Rev 2
5
Application hints
Figure 6.
FC30 electrical connection for 3D orientation detection
The diagram above refers to the electrical connection scheme for application of 3D
orientation detection.
The device core is supplied through the Vdd line while the I/O pads are supplied through the
Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10
F Al) should be
placed as near as possible to pin 6 of the device (common design practice).
All the voltage and ground supplies must be present at the same time for proper behavior of
the IC (
5.1
Soldering information
The LGA package is compliant with the ECOPACK, RoHS and “green” standards. Leave the
pin 1 indicator unconnected during soldering. Land pattern and soldering recommendations
are available at www.st.com
6
8
13
1
Top VIEW
10uF
Vdd
100nF
GND
Vdd_IO
SIG
N
PC
LC
Digital signal from/to signal controller.Signal’s levels are defined by proper selection of Vdd_IO
1
13
8
6
TOP VIEW
Land
Face
Port
PD
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