參數(shù)資料
型號(hào): FIN224ACGFX
廠商: Fairchild Semiconductor
文件頁(yè)數(shù): 9/19頁(yè)
文件大小: 0K
描述: IC SERIALIZER/DESERIALIZER 42BGA
標(biāo)準(zhǔn)包裝: 1
系列: SerDes™
功能: 串行器/解串器
數(shù)據(jù)速率: 676Mbps
輸入類型: LVCMOS
輸出類型: LVCMOS
輸入數(shù): 22
輸出數(shù): 22
電源電壓: 1.65 V ~ 3.6 V
工作溫度: -30°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 42-VFBGA
供應(yīng)商設(shè)備封裝: 42-BGA
包裝: 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁(yè)面: 1217 (CN2011-ZH PDF)
其它名稱: FIN224ACGFXDKR
2006 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FIN224AC Rev.1.1.6
17
F
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2
4
A
C
2
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Physical Dimensions
Figure 16. 40-Terminal, Molded Leadless Package (MLP), Quad, JEDEC MO0220, 6mm Square
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
NOTES:
A. CONFORMS TO JEDEC REGISTRATION MO-220, VARIATION
WJJD-2 WITH EXCEPTION THAT THIS IS A SAWN VERSION..
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994.
D. LAND PATTERN PER IPC SM-782.
E. WIDTH REDUCED TO AVOID SOLDER BRIDGING.
F. DIMENSIONS ARE NOT INCLUSIVE OF BURRS, MOLD FLASH, OR
TIE BAR PROTRUSIONS.
G. DRAWING FILENAME: MKT-MLP40Arev3.
6.00
0.80 MAX
0.10 C
SEATING
PLANE
0.08 C
0.05
0.00
(0.20)
C
0.15 C
PIN #1 IDENT
0.50
4.20
4.00
0.50
0.30
4.20
4.00
0.50
0.10
C A B
0.05
C
0.18-0.30
A
B
6.38MIN
0.20MIN
4.77MIN
4.37MAX
0.28 MAX
0.50TYP
(0.80)
X4
X40
E
(DATUM A)
(DATUM B)
PIN #1 ID
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