參數(shù)資料
型號: FSA201L10X
廠商: Fairchild Semiconductor
文件頁數(shù): 10/19頁
文件大?。?/td> 0K
描述: IC MULTIPLEXER DUAL 10MICROPAK
產(chǎn)品變化通告: Die Material, Mold Compound Change 03/Oct/2008
標準包裝: 1
功能: 多路復(fù)用器
電路: 2 x DPDT
導(dǎo)通狀態(tài)電阻: 6 歐姆
電壓電源: 單/雙電源
電壓 - 電源,單路/雙路(±): 2.7 V ~ 3.6 V,±4.5 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 10-UFQFN
供應(yīng)商設(shè)備封裝: 10-MicroPak?
包裝: 標準包裝
產(chǎn)品目錄頁面: 1218 (CN2011-ZH PDF)
其它名稱: FSA201L10XDKR
2006 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA201 Rev. 1.2.2
18
FSA201
USB2.0
Full-Speed
and
Audio
Swit
ches
with
Negative
Signal
Capability
Physical Dimensions
Figure 29.
10-Lead Molded Small Outline Package (MSOP)
Tape Size
A
B
C
D
N
W1
W2
W3
13
0.059
0.512
0.795
7.008
0.448
0.724
0.486-0.606
(12mm)
(330)
(1.5)
(13)
(20.2)
(178)
(12.4)
(18.4)
(11.9-15.4)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:
http://www.fairchildsemi.com/products/analog/pdf/msop10_tr.pdf.
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