參數(shù)資料
型號: FSA2257MTCX
廠商: Fairchild Semiconductor
文件頁數(shù): 11/11頁
文件大?。?/td> 0K
描述: IC SWITCH DUAL SPDT 14TSSOP
標(biāo)準(zhǔn)包裝: 2,500
功能: 開關(guān)
電路: 2 x SPDT
導(dǎo)通狀態(tài)電阻: 1.5 歐姆
電壓電源: 單電源
電壓 - 電源,單路/雙路(±): 1.65 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 14-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 14-TSSOP
包裝: 帶卷 (TR)
2006 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA2257 A Rev. 1.0.6
9
FS
A2
2
57
Low
R
ON
,
Low
-Vol
tage
Dua
l
SP
DT
B
i-
Di
recti
ona
lAn
alog
Swit
ch
Physical Dimensions (Continued)
Figure 14.
14-Lead, Thin-Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4 mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision.
Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild
Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
AND TIE BAR EXTRUSIONS
F. DRAWING FILE NAME: MTC14REV6
R0.09 min
12.00°
TOP & BOTTOM
0.43 TYP
1.00
D. DIMENSIONING AND TOLERANCES PER ANSI
Y14.5M, 1982
R0.09min
E. LANDPATTERN STANDARD: SOP65P640X110-14M
0.65
6.10
1.65
0.45
A. CONFORMS TO JEDEC REGISTRATION MO-153,
VARIATION AB, REF NOTE 6
B. DIMENSIONS ARE IN MILLIMETERS
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