參數(shù)資料
型號(hào): FSA2268UMX
廠商: Fairchild Semiconductor
文件頁數(shù): 2/12頁
文件大小: 0K
描述: IC SWITCH DUAL SPDT 10UMLP
標(biāo)準(zhǔn)包裝: 1
功能: 開關(guān)
電路: 2 x SPDT
導(dǎo)通狀態(tài)電阻: 300 毫歐
電壓電源: 單電源
電壓 - 電源,單路/雙路(±): 1.65 V ~ 4.3 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 10-UFQFN
供應(yīng)商設(shè)備封裝: 10-UMLP
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: FSA2268UMXDKR
2007 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA2268 / FSA2268T
Rev. 1.1.0
10
FSA2
2
6
8
/
FSA
2
6
8
T
Low
-V
oltage
Dua
l-
S
P
DT
(
0
.4
)An
a
log
S
wi
tch
w
ith
1
6
k
V
E
S
D
Physical Dimensions
Figure 18.
10-Lead Quad Ultrathin Molded Leadless Package (UMLP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision.
Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
For current tape and reel specifications,
visit Fairchild Semiconductor’s online packaging area:
A
B
C
SEATING
PLANE
DETAIL A
PIN#1 IDENT
RECOMMENDED
LAND PATTERN
NOTES:
A. PACKAGE DOES NOT FULLY CONFORM TO
JEDEC STANDARD.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. LAND PATTERN RECOMMENDATION IS
BASED ON FSC DESIGN ONLY.
E. DRAWING FILENAME: MKT-UMLP10Arev3.
TOP VIEW
BOTTOM VIEW
0.15 C
0.08 C
0.15 C
2X
SIDE VIEW
0.10 C
0.05
3
6
1
0.10 C A B
0.05 C
0.55 MAX.
10
1.40
1.80
0.40
0.15
0.25
(10X)
0.35
0.45
(9X)
1.70
2.10
0.40
0.663
0.563
(9X)
0.225
(10X)
1
0.152
0.10
0.55
0.45
0.10
DETAIL A
SCALE : 2X
1.85
1.45
0.55
0.40
0.225
(10X)
9X
0.45
PIN#1 IDENT
OPTIONAL MINIMIAL
TOE LAND PATTERN
SCALE : 2X
LEAD
OPTION 1
SCALE : 2X
LEAD
OPTION 2
PACKAGE
EDGE
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