參數(shù)資料
型號: FSA859UCX
廠商: Fairchild Semiconductor
文件頁數(shù): 10/10頁
文件大?。?/td> 0K
描述: IC SWITCH SPDT 8WLCSP
標準包裝: 1
功能: 開關
電路: 1 x SPDT
導通狀態(tài)電阻: 750 毫歐
電壓電源: 單電源
電壓 - 電源,單路/雙路(±): 1.65 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-WLCSP
供應商設備封裝: 8-WLCSP
包裝: 標準包裝
產品目錄頁面: 1218 (CN2011-ZH PDF)
其它名稱: FSA859UCXDKR
2007 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA859 Rev. 1.0.1
9
FS
A8
59
Dua
l-
Voltage,
0.8
SP
DT
A
nalog
Swit
ch
wi
th
Po
wer
-Of
f
Isolat
ion
Physical Dimensions
SEATING PLANE
0.625
0.547
0.208±0.021
0.378±0.018
D
C
0.06 C
0.05 C
SIDE VIEWS
A1
E
0.50
TOP VIEW
BOTTOM VIEW
(0.50)
RECOMMENDED LAND PATTERN (NSMD)
BALL A1
INDEX AREA
D
0.25
(Y) +/- 0.018
(X) +/- 0.18
1
2
A
B
C
D
1.50
0.005
C A B
B
A
8x 0.260±0.02
0.03 C
2X
0.03 C
2X
(0.300)
SOLDER MASK
OPENING
(0.200)
CU PAD
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
D. DATUM C, THE SEATING PLANE IS DEFINED
BY THE SPHERICAL CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. BALL COMPOSITION: Sn95.5Ag3.9Cu0.6
H. DRAWING FILNAME: MKT-UC008ADrev2
F
FSC Internal Note:
- Type 1 WLCSP provided by
Amkor only.
E
Figure 11. 8-Ball, WLCSP 0.5mm Pitch
Table 1. Product Specific Dimensions
Product
D
E
X
Y
FSA859UCX
1.910
0.910
0.205
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifi
cations do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
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