
FSCTxxA-UH5
9/11
These interfaces offer very low thermal resistance. For example, the Sil-Pad
800 family, from
BERGQUIST, which is designed for low cost applications and low mounting pressures, present a typical
thermal impedance of 0.45 °C.in2/W. This impedance can increase up to 0.92 °C.in2/W for a 10 psi pres-
sure,whichisbelowthenormalatmosphericone(1atm=1013hPa=1013x100x14.5x10-3=14.7psi).
Furthermore, a mounting clip will apply a force between 15 to 50 N. This leads to a 25 to 200 psi pressure.
In this case, the thermal impedance varies from 0.6 to 0.29 °C.in2/W for the Sil-Pad
800 family.
For the example, we take the worst case hypothesis of a 1°C.in2/W interface between the FSCT case and
the heat sink.
We take into account only the tab surface for the heat exchange. This surface equals typically:
S = 4.7 x 5.1 mm
2
= 0.037 in
2
This yields to a supplementary resistance of: R
thc-h
= 1/0.037 = 27°C/W
Then,themaximumpowerdissipatedintheFSCT,forthemaximumoutputpower,isgivenbythefollowing
equation:
P
I
V
CC
CC
The following numerical application gives (for a 150 mA FAN DC current, a 80 gain for the PNP and a 12 V
power supply):
I
OUT
= 150 / 80 = 1.87mA
P
mW
max
.
.
=
×
×
+
×
×
=
3
12
10
187
55
10
46
Then, the temperature error is:
(
The temperature sensing error can then be neglected whan one considers the operation range (from 0 to
100 °C), even with low cost interface material and without any mounting clip. For example, with a higher
pressure, thanks to a clip, this error could be divided by three.
I
V
OUT
OMS
max
=
+
3
3
)
T
C
°
=
×
+
=
0 046
.
3
27
138
.
4. TEMPERATURE/VOLTAGE SLOPE CHANGE
The OUT voltage versus temperature characteristic of the FSCT has been designed to fit majority cases of
application, in the field of PC power supplies.
The advantage for the user is to have a minimum count of components while achieving a smart
temperature regulation.
Nevertheless, some applications require dedicated temperature regulation characteristic. Figure 13
provides an example of a solution which allows to change the ratio between PNP base voltage and the
temperature. This schematic only requires a dual
single-voltage amplifier (in DIL8 package for
example)
and
less
than
ten
supplementary
resistors.
This schematic keeps the advantage of applying a
constant minimum voltage (V
OMS
) below T
MS
tem-
perature. Indeed, the U1A operational amplifier
subtracts 5.1 V (thanks to the D1 Zener diode, re-
fer to V
REF
) from V
OUT
. This means that the ratio
change is only taken into account when V
OUT
is
lower than 5.1 V. Forhighervoltages(V
OMS
inmode
ONorV
CC
inmodeOFF),thenewbasetoGNDvolt-
age (V
NEW
) remains the same (cf. figure 12).
So, if one wants to increase accurately the
voltage-temperature ratio, i.e. that V
OUT
will
decrease more quickly when T
j
increases, figure
13 schematics should be implemented. Indeed,
the voltage at the operational amplifier U1B (which
acts as a follower) output is:
V
V
if V
RN
RD
(
)
V
V
V
V
V
otherw
NEW
OUT
OUT
REF
NEW
OUT
REF
OUT
=
>
=
ise
Mode OFF
Mode ON
V
OUT
V
NEW
T (°C)
V
OMS
Step-down
T
ON
T
OFF
Fig. 12:
Modified characteristics.