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2009 FOX ELECTRONICS | ISO9001:2000 Certified
OUTPUT(Pin3)
ACTIVE
HighZ
EnAblE / DisAblE FunctiOn
INH(Pin1)
OPEN2
'1'LevelVih
≥ 70%Vdd
'0'LevelVil
≤ 30%Vdd
13.000~160.000MHz
-55C~+125C
±100PPM1
3.3V±10%
20mA
25mA
30mA
40mA
10nS
8nS
5nS
4nS
10nS
8nS
5nS
4nS
40%~60%
10%Vdd
90%VddMin
8mAMin
-8mAMin
15pF
10A
10mS
100nS
2mS
10mS
±0.25%~±2.0%
-0.5%~-4.0%
±3PPM/Year
260C/10Seconds
1
Au
PARAMETERS
FrequencyRange (Fo)
StorageTemperatureRange (Tstg)
FrequencyStability(demodulatedfrequency)
SupplyVoltage
(Vdd)
InputCurrent
(Idd)
13.000000~49.999999MHz
50.000000~79.999999MHz
80.000000~99.999999MHz
100.000000~160.000000MHz
RiseTime(10%~90%Vdd)(Tr)
13.000000~49.999999MHz
50.000000~79.999999MHz
80.000000~99.999999MHz
100.000000~160.000000MHz
FallTime(90%~10%Vdd)(Tf)
13.000000~49.999999MHz
50.000000~79.999999MHz
80.000000~99.999999MHz
100.000000~160.000000MHz
OutputSymmetry(50%Vdd)
OutputVoltage
(HCMOS)
OutputLow(Vol)
OutputHigh(Voh)
OutputCurrent
(Iol)
(Ioh)
OutputLoad
StandbyCurrent(FSS73S)
StartupTime
DisableTime
EnableTime
FSS73B(Tristate)
FSS73S (Standby)
SpreadSpectrumFunction
(SeeModelSelectionGuide,Page2)
CenterSpread
DownSpread
Aging
MaximumSolderingTemp/Time
MoistureSensitivityLevel(MSL)
TerminationFinish
ElEctRicAl cHARActERistics
MAX (unlessotherwisenoted)
1Inclusiveofinitialfrequencytoleranceandoperatingtemperaturerange.
(Otherstabilitiesto±20PPMavailable.)
2Aninternalpullupresistorfrompin1topin4allowsactiveoutputifpin1isleftopen.
Note: Drawing is for reference to critical specifications defined by size measurements.
Certainnon-criticalvisualattributes,suchassidecastellations,referencepinshape,etc.may
vary. The above specifications, having been carefully prepared and checked, are believed to be
acurateatthetimeofpublication;however,noresponsibilityisassumedbyFoxElectronicsfor
inaccuracies. All specifications subject to change without notice.
Rev. 12/9/2008
RoHs compliant / Pb Free
Model: Fss73 series
Page1of3
HcMOs 7x5mm 3.3V sMD Oscillator
Spread Spectrum
Fox Electronics Spread Spectrum Oscillators use industry-leading, proven, analog technologies which allows
them to be used in a wide range of high-performance applications. These products offer various down-spread and
center-spread options, enabling the customer to optimize the EMI reduction for their application requirements.
All dimensions are in millimeters.
5.2 M ax
1.4 M ax
7.2 M ax
Solder Pad Layout
Recommended
#1
#2
#3
#4
#1
#2
#4
#3
2.6±0.1
Pin Connections
#1 E/D
#3 Output
#2 GND #4 V
1.6
5.08
DD
1.4
1.8
5.8±0.2
1.2
4.2
Top
View
Dot denotes
pin 1
Bottom
View