參數(shù)資料
型號: FT4232H MINI MODULE
廠商: FTDI, Future Technology Devices International Ltd
文件頁數(shù): 36/45頁
文件大?。?/td> 0K
描述: MOD USB HS FT4232H EVAL
產(chǎn)品變化通告: Part Number Change Jan 2011
產(chǎn)品目錄繪圖: FT(22, 42)32HQ MINI MOD
標(biāo)準(zhǔn)包裝: 5
主要目的: 接口,USB 2.0 至 UART(RS232)電橋
嵌入式: 是,ASIC
已用 IC / 零件: FT4232H
主要屬性: 高速,300 波特 ~ 12 M 波特,安全識別號
次要屬性: 仿真 JTAG、SPI、I2C、位響應(yīng)或其它同步串行
已供物品:
產(chǎn)品目錄頁面: 633 (CN2011-ZH PDF)
相關(guān)產(chǎn)品: FT4232HQ - TRAY-ND - IC USB HS QUAD UART/SYNC 64-QFN
FT4232HL - TRAY-ND - IC USB HS QUAD UART/SYNC 64-LQFP
768-1027-6-ND - IC USB HS QUAD UART/SYNC 64-QFN
768-1026-6-ND - IC USB HS QUAD UART/SYNC 64-LQFP
768-1027-1-ND - IC USB HS QUAD UART/SYNC 64-QFN
768-1026-1-ND - IC USB HS QUAD UART/SYNC 64-LQFP
768-1027-2-ND - IC USB HS QUAD UART/SYNC 64-QFN
768-1026-2-ND - IC USB HS QUAD UART/SYNC 64-LQFP
其它名稱: 768-1031
FT4232HQ_MINI MOD
Copyright 2010 Future Technology Devices International Limited
41
Document No.: FT_000060
FT4232H QUAD HIGH SPEED USB TO MULTIPURPOSE UART/MPSSE IC
Datasheet Version 2.2
Clearance No.: FTDI#78
Profile Feature
Pb Free Solder Process
(green material)
SnPb Eutectic and Pb free (non
green material) Solder Process
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
150°C
200°C
60 to 120 seconds
100°C
150°C
60 to 120 seconds
Time Maintained Above Critical Temperature
TL:
- Temperature (TL)
- Time (tL)
217°C
60 to 150 seconds
183°C
60 to 150 seconds
Peak Temperature (Tp)
260°C
Time within 5°C of actual Peak Temperature
(tp)
30 to 40 seconds
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
Time for T= 25°C to Peak Temperature, Tp
8 minutes Max.
6 minutes Max.
Table 8.2 Reflow Profile Parameter Values
SnPb Eutectic and Pb free (non green material)
Package Thickness
Volume mm3 < 350
Volume mm3 >=350
< 2.5 mm
235 +5/-0 deg C
220 +5/-0 deg C
≥ 2.5 mm
220 +5/-0 deg C
Pb Free (green material) = 260 +5/-0 deg C
Table 8.3 Package Reflow Peak Temperature
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