參數(shù)資料
型號: FT4232HQ-REEL
廠商: FTDI, Future Technology Devices International Ltd
文件頁數(shù): 36/45頁
文件大?。?/td> 0K
描述: IC USB HS QUAD UART/SYNC 64-QFN
標(biāo)準(zhǔn)包裝: 1
系列: USBmadeEZ-FIFO
特點(diǎn): USB 至 UART 和(或)SPI、I2C、JTAG
通道數(shù): 4,QUART
FIFO's: 2048 字節(jié)
規(guī)程: RS232,RS422,RS485
電源電壓: 3 V ~ 3.6 V
帶自動(dòng)流量控制功能:
帶調(diào)制解調(diào)器控制功能:
帶CMOS:
安裝類型: 表面貼裝
封裝/外殼: 64-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 64-QFN 裸露焊盤(9x9)
包裝: 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁面: 634 (CN2011-ZH PDF)
配用: 768-1031-ND - MOD USB HS FT4232H EVAL
其它名稱: 768-1027-6
Copyright 2010 Future Technology Devices International Limited
41
Document No.: FT_000060
FT4232H QUAD HIGH SPEED USB TO MULTIPURPOSE UART/MPSSE IC
Datasheet Version 2.2
Clearance No.: FTDI#78
Profile Feature
Pb Free Solder Process
(green material)
SnPb Eutectic and Pb free (non
green material) Solder Process
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
150°C
200°C
60 to 120 seconds
100°C
150°C
60 to 120 seconds
Time Maintained Above Critical Temperature
TL:
- Temperature (TL)
- Time (tL)
217°C
60 to 150 seconds
183°C
60 to 150 seconds
Peak Temperature (Tp)
260°C
Time within 5°C of actual Peak Temperature
(tp)
30 to 40 seconds
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
Time for T= 25°C to Peak Temperature, Tp
8 minutes Max.
6 minutes Max.
Table 8.2 Reflow Profile Parameter Values
SnPb Eutectic and Pb free (non green material)
Package Thickness
Volume mm3 < 350
Volume mm3 >=350
< 2.5 mm
235 +5/-0 deg C
220 +5/-0 deg C
≥ 2.5 mm
220 +5/-0 deg C
Pb Free (green material) = 260 +5/-0 deg C
Table 8.3 Package Reflow Peak Temperature
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