參數(shù)資料
型號: FTR-B4SA003Z-B05
廠商: Fujitsu Limited
英文描述: ULTRA MINIATURE RELAY SLIM SIGNAL RELAY
中文描述: 超小型繼電器SLIM的信號中繼
文件頁數(shù): 8/9頁
文件大?。?/td> 1006K
代理商: FTR-B4SA003Z-B05
FTR-B4 Series
8
RoHS Compliance and Lead Free Relay Information
Reflow Solder condtion
3. Moisture Sensitivity
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MoistureSensitivityLevelstandardisnotapplicabletoelectromechanicalrealys.
4. Tin Whisker
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SnAgCuandSnCuNisolderisknownaslowriskoftinwhisker.Noconsiderablelengthwhiskerwasfound
byourin-housetest.
Wehighlyrecommendthatyouconfirmyouractualsolderconditions
Flow Solder condtion:
Pre-heating:
Soldering:
maximum120C
dipwithin5sec.at
260Csolerbath
Solder by Soldering Iron:
SolderingIron
Temperature:
Duration:
maximum360C
maximum3sec.
1. General Information
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Relaysproducedafterthespecificdatecodethatisindicatedoneachdatasheetarelead-free
now.Mostofoursignalandpowerrelaysarelead-free.PleaserefertoLead-FreeStatusInfo.
(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)
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LeadfreesolderpastecurrentlyusedinrelaysisSn-3.0Ag-0.5Cu.FromFebruary2005forward
Sn-3.0CU-NiwillbeusedfortheFTR-B3andFTR-B4seriesrelays.
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AllsignalandmostpowerrelaysalsocomplywithRoHS.Pleaserefertoindividualdata
sheets.RelaysthatareRoHScompliantdonotcontainthe5hazardousmaterialsthat
arerestrictedbyRoHSdirective(lead,mercury,chromiumIV,PBB,PBDE).
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Ithasbeenverifiedthatusinglead-freerelaysinleadedassemblyprocesswillnotcauseany
problems(compatible).
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“LF”ismarkedoneachouterandinnercarton.(Nomarkingonindividualrelays).
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Toavoidleadedrelays(forlead-freesample,etc.)pleaseconsultwithareasalesoffice.
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Wewillshipleadedrelaysaslongastheleadedrelayinventoryexists.
Note:CadmiumwasexemptedfromRoHSonOctober21,2005.(AmendmenttoDirective2002/95/EC)
2.
Recommended Lead Free Solder Profile
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RecommendedsolderpasteSn-3.0Ag-0.5CuamdSm-3.0Cu-Ni(onlyFTR-B3andFTR-B4from
February2005.
max. 120 sec.
90~120 sec.
20~30 sec.
(duration)
Cooling
Pre-heating
Soldering
Peak Temp.: max. 250 C
250
220
130
170
T
相關PDF資料
PDF描述
FTR-B4SA006Z-B05 ULTRA MINIATURE RELAY SLIM SIGNAL RELAY
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