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參數(shù)資料
| 型號(hào)： | FW150F9 |
| 元件分類(lèi)： | 電源模塊 |
| 英文描述： | 1-OUTPUT 99 W DC-DC REG PWR SUPPLY MODULE |
| 文件頁(yè)數(shù)： | 4/16頁(yè) |
| 文件大?。?/td> | 1150K |
| 代理商： | FW150F9 |
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12
Tyco Electronics Corp.
Data Sheet
September 1997
dc-dc Converter; 36 to 72 Vdc Input, 3.3 Vdc Output; 99 W
FW150F Power Module:
Thermal Considerations (continued)
Custom Heat Sinks
A more detailed model can be used to determine the
required thermal resistance of a heat sink to provide
necessary cooling. The total module resistance can be
separated into a resistance from case-to-sink (
θcs) and
sink-to-ambient (
θsa) shown below (Figure 22):
8-1304 (C)
Figure 22. Resistance from Case-to-Sink and Sink-
to-Ambient
For a managed interface using thermal grease or foils,
a value of
θcs = 0.1 °C/W to 0.3 °C/W is typical. The
solution for heat sink resistance is:
This equation assumes that all dissipated power must
be shed by the heat sink. Depending on the user-
dened application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation provides
a conservative estimate for such instances.
Layout Considerations
Copper paths must not be routed beneath the power
module standoffs.
PD
TC
TS
TA
cs
sa
θsa
TC
TA
–
()
PD
------------------------
θcs
–
=
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