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15
Tyco Electronics Corp.
Data Sheet
September 2001
36 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Thermal Considerations (continued)
Heat Transfer with Heat Sinks (continued)
8-1321
Figure 23. Case-to-Ambient Thermal Resistance
Curves; Transverse Orientation
8-1320
Figure 24. Case-to-Ambient Thermal Resistance
Curves; Longitudinal Orientation
These measured resistances are from heat transfer
from the sides and bottom of the module as well as the
top side with the attached heat sink; therefore, the
case-to-ambient thermal resistances shown are gener-
ally lower than the resistance of the heat sink by itself.
The module used to collect the data in Figures
23 and
24 had a thermal-conductive dry pad between the case
and the heat sink to minimize contact resistance.
To choose a heat sink, determine the power dissipated
as heat by the unit for the particular application.
Figures
25 and
26 show typical heat dissipation for a
range of output currents and three voltages for the
FW250H1 and FW300H1.
8-1711
Figure 25. FW250H1 Power Dissipation vs. Output
Current
8-1712
Figure 26. FW300H1 Power Dissipation vs. Output
Current
0
0.5
(100)
1.0
(200)
1.5
(300)
2.0
(400)
2.5
(500)
3.0
(600)
0.0
0.5
3.0
3.5
4.0
4.5
2.5
2.0
1.0
CASE-
TO
-A
M
B
IE
NT
T
H
ERM
A
L
1.5
AIR VELOCITY, m/s (ft./min.)
RESI
ST
ANCE,
θ
CA
(
°C/
W)
1 1/2 IN. HEAT SINK
1 IN. HEAT SINK
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
NO HEAT SINK
0
0.5
(100)
1.0
(200)
1.5
(300)
2.0
(400)
2.5
(500)
3.0
(600)
0.0
0.5
3.0
3.5
4.0
4.5
2.5
2.0
1.0
CA
SE-
T
O
-A
M
B
IENT
T
H
E
R
M
A
L
1.5
AIR VELOCITY, m/s (ft./min.)
RESI
ST
ANCE,
θ
CA
(
°C/W)
1 1/2 IN. HEAT SINK
1 IN. HEAT SINK
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
NO HEAT SINK
0
OUTPUT CURRENT, IO (A)
PO
WE
R
DI
SSI
PAT
IO
N,
P
D
(W
)
123
4
5
67
35
30
25
20
15
10
5
0
89
10
VI = 75 V
VI = 55 V
VI = 36 V
50
0
OUTPUT CURRENT, IO (A)
POWER
DISS
IP
A
T
ION,
P
D
(W
)
246
8
10
12
45
40
35
30
25
20
15
10
5
0
VI = 75 V
VI = 55 V
VI = 36 V