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參數(shù)資料
| 型號(hào)： | FW300A1-A |
| 廠商： | LINEAGE POWER LLC |
| 元件分類： | 電源模塊 |
| 英文描述： | 1-OUTPUT 300 W DC-DC REG PWR SUPPLY MODULE |
| 封裝： | MODULE-20 |
| 文件頁數(shù)： | 15/20頁 |
| 文件大小： | 796K |
| 代理商： | FW300A1-A |
4
Lineage Power
Data Sheet
April 2008
36 Vdc to 75 Vdc Input, 5 Vdc Output; 300 W
FW300A1-A Power Module; dc-dc Converter:
General Specifications
Parameter
Min
Typ
Max
Unit
Calculated MTBF (IO = 80% of IO, max; TC = 40 °C)
1,700,000
hours
Weight
—
200 (7)
g (oz.)
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See the Feature Descriptions section for further information.
Parameter
Symbol
Min
Typ
Max
Unit
Remote On/Off Signal Interface
(VI = 0 V to 75 V; open collector or equivalent
compatible; signal referenced to VI(–) terminal):
Logic Low—Module On
Logic High—Module Off
Logic Low:
At Ion/off = 1.0 mA
At Von/off = 0.0 V
Logic High:
At Ion/off = 0.0 A
Leakage Current
Turn-on Time
(IO = 80% of IO, max; VO within ±1% of steady state)
Output Voltage Overshoot
Von/off
Ion/off
Von/off
Ion/off
—
0
—
30
0
1.2
1.0
15
50
5
V
mA
V
A
ms
%VO, set
Output Voltage Adjustment:
Output Voltage Remote-sense Range
Output Voltage Set-point Adjustment Range (trim)
—
60
—
0.7
114
V
%VO, nom
Output Overvoltage Protection
—
6.0*
—
7.0*
V
Output Current Monitor (IO = IO, max, TC = 70 °C)
IO, mon
—
0.065
—
V/A
Synchronization:
Clock Amplitude
Clock Pulse Width
Fan-out
Capture Frequency Range
—
4.00
0.4
—
425
—
5.00
—
1
575
V
s
—
kHz
Overtemperature Protection (See Figure 16.)
TC
—
105
—
°C
Forced Load Share Accuracy
—
10
—
%IO, rated
Power Good Signal Interface:
Low Impedance—Module Operating
High Impedance—Module Off
Rpwr/good
Ipwr/good
Rpwr/good
Vpwr/good
—
1
—
100
1
—
40
mA
M
V
* These are manufacturing test limits. In some situations, results may differ.
Solder, Cleaning, and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly process prior to electrical testing. The result of inad-
equate circuit-board cleaning and drying can affect both the reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on appropriate soldering, cleaning, and drying procedures, refer to
the Board-Mounted Power Modules Soldering and Cleaning Application Note (AP97-021EPS).
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