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| 型號： | FW80200M400 |
| 英文描述： | Microprocessor |
| 中文描述： | 微處理器 |
| 文件頁數(shù)： | 22/36頁 |
| 文件大?。?/td> | 461K |
| 代理商： | FW80200M400 |
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Intel
80200 Processor based on Intel
XScale
Microarchitecture
Package Information
22
August 2002
Datasheet
3.2
Package Thermal Specifications
3.3
Package Thermal Resistance
The Intel
80200 processor is specified for operation when T
C
(case temperature) is within the
range of 0°C to 90°C. Case temperature may be measured in any environment to determine
whether the device is within its specified operating range. The case temperature should be
measured at the center of the top surface, opposite the pins.
θ
CA
is the thermal resistance from case to ambient. Use the following equation to calculate T
A
, the
maximum ambient temperature to conform to a particular case temperature:
T
A
= T
C
- P (
θ
CA
)
Junction temperature (T
J
) is commonly used in reliability calculations. T
J
can be calculated from
θ
JC
(thermal resistance from junction to case) using the following equation:
T
J
= T
C
+ P (
θ
JC
)
Similarly, when T
A
is known, the corresponding case temperature (T
C
) can be calculated as
follows:
T
C
= T
A
+ P (
θ
CA
)
Figure 3
and
Figure 4
show an application of the supplied thermal data. Here, we plot the case
temperature under several conditions.
Table 8.
Package Thermal Resistance
— °
C/Watt
Parameter
Airflow
—
ft./min (m/sec)
0
(0)
200
(1.01)
400
(2.03)
600
(3.04)
θ
JC
(Junction-to-Case)
θ
CA
(Case-to-Ambient) (No Heatsink)
1.5
1.5
1.5
1.5
28.5
20.0
18.1
17.1
NOTES:
1. This table applies to an PBGA device soldered directly into a board with all
V
SS
connections.
2.
θ
JA
=
θ
JC
+
θ
CA
θ
JA
θ
JC
θ
CA
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|---|---|
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| FW80200M600SL677 | 功能描述:IC I/O PROCESSOR 600MHZ 241-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤 |
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