Ver: 1.2
Jun 29, 2005
TEL: 886-3-5788833
http://www.gmt.com.tw
15
G1422
Global Mixed-mode Technology Inc.
Package Information
TSSOP-20 (FD) Package
Note:
1. JEDCE outline: MP-153 AC/MO-153 ACT (thermally enhanced variations only)
2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall
not exceed 0.15 per side.
3. Dimension “E1” does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed
0.25 per side.
4. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in ex-
cess of the “b” dimension at maximum material conditions. Dambar cannot be located on the lower radius of
the foot. Minimum space between protrusion and adjacent lead is 0.07mm.
5. Dimensions “D” and “E1” to be determined at datum plane “H”.
DIMENSION IN MM
DIMENSION IN INCH
SYMBOLS
MIN
NOM
MAX
MIN
NOM
MAX
A
-----
1.20
-----
0.047
A1
0.00
-----
0.15
0.000
-----
0.006
A2
0.80
1.00
1.05
0.031
0.039
0.041
b
0.19
-----
0.30
0.007
-----
0.012
C
0.20
-----
0.008
-----
D
6.40
6.50
6.60
0.252
0.256
0.260
D1
3.90
-----
4.40
0.154
-----
0.173
E
6.40 BSC
0.252 BSC
E1
4.30
4.40
4.50
0.169
0.173
0.177
E2
2.70
-----
3.20
0.106
-----
0.126
e
0.65 BSC
0.026 BSC
L
0.45
0.60
0.75
0.018
0.024
0.030
θ
0
-----
8
0
-----
8
Taping Specification
PACKAGE
Q’TY/BY REEL
TSSOP-20 (FD)
2,500 ea
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
Feed Direction
Typical TSSOP Package O rientation
Feed Direction
Typical TSSOP Package O rientation
E1 E
D
b
A1
A2
L
θ
e
D1
E2
0.05
A
0.1
27
T
Y
P
C
H
E1 E
D
b
A1
A2
L
θ
e
D1
E2
0.05
A
0.1
27
T
Y
P
C
H