參數(shù)資料
型號: GF1G
廠商: Vishay Intertechnology,Inc.
元件分類: 參考電壓二極管
英文描述: Surface Mount Glass Passivated Rectifier
中文描述: 表面安裝玻璃鈍化整流
文件頁數(shù): 1/2頁
文件大小: 90K
代理商: GF1G
GF1A THRU GF1M
SURFACE MOUNT GLASS PASSIVATED JUNCTION RECTIFIER
Reverse Voltage - 50 to 1000 Volts
Forward Current - 1.0 Ampere
FEATURES
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
Ideal for surface mount automotive applications
High temperature metallurgically bonded construction
Glass passivated cavity-free junction
Capable of meeting environmental standards of
MIL-S-19500
Built-in strain relief
Easy pick and place
High temperature soldering guaranteed: 450°C/5 seconds
at terminals
Complete device submersible temperature of 265°C for
10 seconds in solder bath
MECHANICAL DATA
Case: JEDEC DO-214BA molded plastic over glass body
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.0048 ounces, 0.120 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS
GF1A
GF1B
GF1D
GF1G
GF1J
GF1K
GF1M
UNITS
Device marking code
GA
GB
GD
GG
GJ
GK
GM
Maximum repetitive peak reverse voltage
VRRM
50
100
200
400
600
800
1000
Volts
Maximum RMS voltage
VRMS
35
70
140
280
420
560
700
Volts
Maximum DC blocking voltage
VDC
50
100
200
400
600
800
1000
Volts
Maximum average forward rectified current
at TL=125°C
I(AV)
1.0
Amp
Peak forward surge current
8.3ms single half sine-wave superimposed on
IFSM
30.0
Amps
rated load (JEDEC Method)
Maximum instantaneous forward voltage at 1.0A
VF
1.10
1.20
Volts
Maximum DC reverse current
TA=25°C
5.0
at rated DC blocking voltage
TA=125°C
IR
50.0
A
Typical reverse recovery time (NOTE 1)
trr
2.0
s
Typical junction capacitance (NOTE 2)
CJ
15.0
pF
Typical thermal resistance (NOTE 3)
R
ΘJA
80.0
°C/W
R
ΘJL
26.0
Operating junction and storage temperature range
TJ, TSTG
-65 to +175
°C
NOTES:
(1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A
(2) Measured at 1.0 MHz and applied VR=4.0 Volts
(3) Thermal resistance from junction to ambient and from junction to lead
P.C.B. mounted on 0.2 x 0.2” (5.0 x 5.0mm) copper pad areas
4/98
0.167 (4.24)
0.187 (4.75)
0.0065 (0.17)
0.0105 (0.27)
0.030 (0.76)
0.060 (1.52)
0.006
0.152
TYP.
0.196 (4.98)
0.226 (5.74)
0.094 (2.39)
0.114 (2.90)
0.106 (2.69)
0.118 (3.00)
0.040 (1.02)
0.060 (1.52)
0.098 (2.49)
0.108 (2.74)
DO-214BA
PA
TENTED*
Dimensions in inches and (millimeters)
*Glass-plastic encapsulation technique is covered by
Patent No. 3,996,602, brazed-lead assembly by Patent No. 3,930,306 and lead
forming by Patent No. 5,151,846
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