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***
Genesis Microchip Confidential ***
gm5110/20 Preliminary Data Sheet
June 2002
40
C5110-DAT-01C
5. ELECTRICAL SPECIFICATIONS
The following targeted specifications have been derived by simulation.
5
5
.
.
1
1
P
P
r
r
e
e
l
l
i
i
m
i
i
n
n
a
a
r
r
y
y
D
D
C
C
C
C
h
h
a
a
r
r
a
a
c
c
t
t
e
e
r
r
i
i
s
s
t
t
i
i
c
c
s
s
Table 20. Absolute Maximum Ratings
PARAMETER
3.3V Supply Voltages
(1,2)
2.5V Supply Voltages
(1.2)
Input Voltage (5V tolerant inputs)
(1,2)
Input Voltage (non 5V tolerant inputs)
(1,2)
Electrostatic Discharge
Latch-up
Ambient Operating Temperature
Storage Temperature
Operating Junction Temp.
Thermal Resistance (Junction to Air) Natural Convection
(3)
Thermal Resistance (Junction to Case) Convection
(4)
Soldering Temperature (30 sec.)
Vapor Phase Soldering (30 sec.)
SYMBOL
V
VDD_3.3
V
VDD_2.5
V
IN5Vtol
V
IN
V
ESD
I
LA
T
A
T
STG
T
J
MIN
-0.3
-0.3
-0.3
-0.3
0
-40
0
TYP
MAX
3.6
2.75
5.5
3.6
±
2.0
±
100
70
125
125
UNITS
V
V
V
V
kV
mA
°
C
°
C
°
C
gm5110
gm5120
θ
JA_5110
θ
JA_5120
θ
JC_5110
θ
JC_5120
T
SOL
T
VAP
32.4
22.0
°
C/W
gm5110
gm5120
13.9
10.1
220
220
°
C/W
°
C
°
C
NOTE (1):
All voltages are measured with respect to GND
NOTE (2):
Absolute maximum voltage ranges are for transient voltage excursions.
NOTE (3):
Package thermal resistance is based on a PCB with one signal plane and two power planes. Package
θ
JA
is improved on a PCB with
four or more layers
NOTE (4):
Based on the figures for the Operating Junction Temperature,
θ
JC
and Power Consumption in Table 21, the typical case temperature
is calculated as
T
C
= T
J
- P
x
θ
JC
. This equals 104 degrees Celsius for gm5110 and 106 degrees Celsius for gm5120.