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參數(shù)資料
| 型號： | GP2W0118YPS |
| 英文描述： | INFRARED DATA COMMUNICATION DEVICE |
| 中文描述： | 紅外數(shù)據(jù)通信設(shè)備 |
| 文件頁數(shù)： | 9/15頁 |
| 文件大小： | 127K |
| 代理商： | GP2W0118YPS |
Infrared Transceiver
GP2W0004YP/XP
IrDA Technical Information
9
Soldering Reflow Profile
Figure 15 is a straight-line representation of the rec-
ommended temperature profile for the IR solder reflow
process. The temperature profile is divided into four
process sections with three temperature/time change
rates. The temperature/time details are described in
Table 3.
In process section 1, the PCB and SMD
GP2W0004YP molded pinout joints are heated to a
temperature of 165°C to activate the flux in the solder
paste. The temperature ramp-up rate R1 should be
within the range of 1°C to 5°C per second. Package
temperature must be kept within the temperature range
specified in order to avoid localized temperature rise in
the resin.
In process section 2, sufficient time to dry the solder
paste should be provided, a maximum of 120 seconds
is recommended for optimum results. A stable temper-
ature is recommended with little temperature increase,
preferably staying at the level of 165°C.
Process section 3 is solder reflow. The temperature
should be raised to 240°C for 10 seconds, at the rate of
1°C to 4°C per second (R2) for the desired result. The
dwell time above 200°C must not exceed 60 seconds.
Beyond 60 seconds, weak and unreliable connections
will result.
Process section 4 is cooling. After solder reflow, the
temperature should then be reduced at the rate of -1°C
to -4°C per second (R3). Please note that deformation
of the PCB can also affect the pins of the package,
which may break the gold wire used in the transceiver
module. Full confirmation of the soldering reflow
machine condition is highly recommended for optimal
results.
Hand soldering should be conducted with a soldering
iron of less than 25 W, at less than 300°C. Soldering
time is less than 5 seconds per contact, with a second
or two between soldering each contact. The device
being soldered by hand should be at room temperature.
Use 60/40 or 63/37 solder, or Ag solder if it is available.
Table 3. Process Section Information
PROCESS SECTION
TEMPERATURE
SYMBOL
TERMPERATURE/TIME MAX.
1. Heat Up
2. Solder Paste Dry
3. Solder Reflow
4. Cooling
~165°C
165°C
165°C - 240°C
~200°C
R1
1°C - 5°C/sec. MAX.
R2
R3
1°C - 5°C/sec. MAX.
-1°C - 4°C/sec. MAX.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| GP2W0118YPS0F | 制造商:Sharp Microelectronics Corporation 功能描述: |
| GP2W0130YP0F | 制造商:Sharp Microelectronics Corporation 功能描述: |
| GP2W0150XP0F | 功能描述:光纖發(fā)射器、接收器、收發(fā)器 IrDA 115kb 20cm Top View RoHS:否 制造商:Omron Electronics 產(chǎn)品:Transmitters 數(shù)據(jù)速率:3.5 Gbps 波長:850 nm 最大工作溫度: 最小工作溫度: 封裝 / 箱體: 封裝: |
| GP2W0150YP0F | 制造商:SHARP 功能描述:INFRARED DATA COMMUNICATION DEVICE |
| GP2W1001YP | 功能描述:IRDA MODULE 115.2KBPS 10SMD RoHS:否 類別:傳感器，轉(zhuǎn)換器 >> IrDA 收發(fā)器模塊 系列:* 產(chǎn)品變化通告:Product Discontinuation 30/Sept/2009 產(chǎn)品目錄繪圖:GP2W Series 標(biāo)準(zhǔn)包裝:1 系列:* 數(shù)據(jù)速率:115.2kbs（SIR） 電源電壓:2.4 V ~ 3.6 V 無效電流，標(biāo)準(zhǔn)值@ 25° C:70µA 通信距離，低功率:20cm 方向:側(cè)視圖 工作溫度:-40°C ~ 85°C 尺寸:8.3mm x 2.1mm x 1.7mm 標(biāo)準(zhǔn):IrPHY 1.4 關(guān)機:* 包裝:Digi-Reel® 其它名稱:425-2614-6 |
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