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| 型號(hào)： | GP5000S35-0.040-02-0816 |
| 廠商： | Bergquist |
| 文件頁(yè)數(shù)： | 1/1頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | THERMAL PAD .040" 8X16 GAPPAD |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | Gap Pad® 5000S35 |
| 使用： | TO-220 |
| 形狀： | 矩形 |
| 外形： | 406.40mm x 203.20mm |
| 厚度： | 0.040"（1.02mm） |
| 材質(zhì)： | 硅質(zhì) |
| 膠合劑： | 膠粘 - 兩側(cè) |
| 背襯，載體： | 玻璃纖維 |
| 顏色： | 綠 |
| 導(dǎo)熱性： | 5.0 W/m-K |
| 其它名稱： | BER328 GP5000S35-0.040-020-816 GP5000S35-0.040-020-816-ND Q4891510 |
www.bergquistcompany.com
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR
MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_GP_5000S35_12.08
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company -
European Headquarters
Bramenberg 9a, 3755 BT Eemnes
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company - Asia
Room 15, 8/F Wah Wai Industrial Centre
No. 38-40, Au Pui Wan Street
Fotan, Shatin, N.T. Hong Kong
Ph: 852.2690.9296
Fax: 852.2690.2344
Gap Pad 5000S35
High thermal conductivity plus “S-Class” softness and conformability
Gap Pad
: U.S. Patent 5,679,457 and others
Features and Benefits
High thermal conductivity: 5 W/m-K
Highly conformable, “S-Class” softness
Natural inherent tack reduces interfacial
thermal resistance
Conforms to demanding contours
and maintains structural integrity with
little or no stress applied to fragile
component leads
Fiberglass reinforced for puncture, shear
and tear resistance
Excellent thermal performance at
low pressures
Gap Pad 5000S35 is a fiberglass-reinforced
filler and polymer featuring a high thermal
conductivity. The material yields extremely
soft characteristics while maintaining elasticity
and conformability.The fiberglass reinforcement
provides easy handling and converting, added
electrical isolation and tear resistance.The
inherent natural tack on both sides assists in
application and allows the product to effec-
tively fill air gaps, enhancing the overall ther-
mal performance.The top side has reduced
tack for ease of handling. Gap Pad 5000S35 is
ideal for high-performance applications at low
mounting pressures.
Typical Applications
CDROM / DVD ROM
Voltage Regulator Modules ( VRMs) and POLs
Thermally-enhanced BGAs
Configurations Available:
Die-cut parts are available in any shape or size, separated or in sheet form
Custom thicknesses available upon request
Building a Part Number
Standard Options
TYPICAL PROPERTIES OF GAP PAD 5000S35
PROPERTY
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Color
Light Green
Visual
Reinforcement Carrier
Fiberglass
—
Thickness (inch) / (mm)
0.020 to 0.125
0.508 to 3.175
ASTM D374
Inherent Surface Tack (1or 2 sided)
2
—
Density (g/cc)
3.6
ASTM D792
Heat Capacity (J/g-K)
1.0
ASTM E1269
Hardness Bulk Rubber (Shore 00) (1)
35
ASTM D2240
Young’s Modulus (psi) / (kPa) (2)
17.5
121
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
>5000
ASTM D149
Dielectric Constant (1000 Hz)
7.5
ASTM D150
Volume Resistivity (Ohm-meter)
109
ASTM D257
Flame Rating
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
5.0
ASTM D5470
THERMAL PERFORMANCE VS. PRESSURE
Pressure (psi)
10
25
50
TO-220 Thermal Performance (C/W) (20 mil)
1.18
1.10
0.99
Thermal Impedance (C-in2/W) (3)
0.21
0.18
0.15
TO-220 Thermal Performance (C/W) (40 mil)
1.54
1.34
1.15
Thermal Impedance (C-in2/W) (3)
0.30
0.28
0.25
1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a
sample size of 0.79 inch2. For more information on Gap Pad modulus, refer to Bergquist Application Note #116. 3) The ASTM D5470
test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual
application performance is directly related to the surface roughness, flatness and pressure applied.
Memory packages / modules
PC Board to chassis
ASICs and DSPs
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