參數(shù)資料
型號: GS84032AT-166
廠商: Electronic Theatre Controls, Inc.
英文描述: 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs
中文描述: 256 × 18,128K的× 32,128K的× 36 4Mb的同步突發(fā)靜態(tài)存儲器
文件頁數(shù): 16/31頁
文件大小: 911K
代理商: GS84032AT-166
Rev: 1.12 7/2002
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com
16/31
1999, Giga Semiconductor, Inc.
Preliminary
GS84018/32/36AT/B-180/166/150/100
Capacitance
(T
A
= 25
o
C, f = 1 MH
Z
, V
DD
= 3.3 V)
Note: This parameter is sample tested.
Package Thermal Characteristics
Notes:
1.
Junction temperature is a function of SRAM power dissipation, package thermal resistance, mounting board temperature, ambient. Temper-
ature air flow, board density, and PCB thermal resistance.
SCMI G-38-87.
Average thermal resistance between die and top surface, MIL SPEC-883, Method 1012.1.
4. For x18 configuration, consult factory.
2.
3.
Parameter
Symbol
Test conditions
Typ.
Max.
Unit
Control Input Capacitance
C
I
C
IN
C
OUT
V
DD
= 3.3 V
V
IN
= 0 V
V
OUT
= 0 V
3
4
pF
Input Capacitance
4
5
pF
Output Capacitance
6
7
pF
Rating
Layer Board
Symbol
TQFP Max
BGA Max
Unit
Notes
Junction to Ambient (at 200 lfm)
single
R
Θ
JA
R
Θ
JA
R
Θ
JC
40
38
°
C/W
°
C/W
°
C/W
1,2,4
Junction to Ambient (at 200 lfm)
four
24
21
1,2,4
Junction to Case (TOP)
9
5
3,4
20% tKC
V
SS
-2.0V
50%
V
SS
V
IH
Undershoot Measurement and Timing
Overshoot Measurement and Timing
20% tKC
V
DD
+-2.0V
50%
V
DD
V
IL
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
GS84032AT-166I 制造商:GSI 制造商全稱:GSI Technology 功能描述:256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs
GS84032AT-180 制造商:未知廠家 制造商全稱:未知廠家 功能描述:256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs
GS84032AT-180I 制造商:GSI 制造商全稱:GSI Technology 功能描述:256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs
GS84032B-100 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 Fast Synchronous SRAM
GS84032B-100I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 Fast Synchronous SRAM