參數(shù)資料
型號(hào)： GS840H32
廠商： GSI TECHNOLOGY
英文描述： 4Mb（128K x 32Bit) Synchronous Burst SRAM(4M位（128K x 32位）同步靜態(tài)RAM（帶2位脈沖地址計(jì)數(shù)器）)
中文描述： 4Mb的（128K的x 32位）同步突發(fā)靜態(tài)存儲(chǔ)器（4分位（128K的× 32位）同步靜態(tài)隨機(jī)存儲(chǔ)器（帶2位脈沖地址計(jì)數(shù)器））
文件頁(yè)數(shù)： 15/31頁(yè)
文件大?。?/td> 626K
代理商： GS840H32
Rev: 2.04 6/2000
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com
15/31
1999, Giga Semiconductor, Inc.
GS840H18/32/36T/B-180/166/150/100
Absolute Maximum Ratings
(All voltages reference to V
SS
)
Note:
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended
Operating Conditions. Exposure to conditions exceeding the Absolute Maximum Ratings, for an extended period of time, may affect reliability of
this component.
Recommended Operating Conditions
Note:
1.
Unless otherwise noted, all performance specifications quoted are evaluated for worst case at both 2.75V
≤
VDDQ
≤
2.375V (i.e. 2.5V I/O)
and 3.6V
≤
VDDQ
≤
3.135V (i.e. 3.3V I/O) and quoted at whichever condition is worst case.
This device features input buffers compatible with both 3.3V and 2.5V I/O drivers.
Most speed grades and configurations of this device are offered in both Commercial and Industrial Temperature ranges. The part number of
Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are evaluated
for worst case in the temperature range marked on the device.
Input Under/overshoot voltage must be -2V > Vi < V
DD
+2V with a pulse width not to exceed 20% tKC.
2.
3.
4.
Symbol
Description
Value
Unit
V
DD
V
DDQ
V
CK
V
I/O
V
IN
I
IN
I
OUT
P
D
T
STG
T
BIAS
Voltage on V
DD
Pins
Voltage in V
DDQ
Pins
Voltage on Clock Input Pin
-0.5 to 4.6
V
-0.5 to V
DD
-0.5 to 6
V
V
Voltage on I/O Pins
-0.5 to V
DDQ
+0.5 (
≤
4.6 V max.)
-0.5 to V
DD
+0.5 (
≤
4.6 V max.)
+/- 20
V
Voltage on Other Input Pins
V
Input Current on Any Pin
mA
Output Current on Any I/O Pin
+/- 20
mA
Package Power Dissipation
1.5
W
Storage Temperature
-55 to 125
o
C
Temperature Under Bias
-55 to 125
o
C
Parameter
Symbol
Min.
Typ.
Max.
Unit
Notes
Supply Voltage
V
DD
V
DDQ
V
IH
V
IL
T
A
T
A
3.135
3.3
3.6
V
DD
V
I/O Supply Voltage
2.375
2.5
V
1
Input High Voltage
1.7
---
V
DD
+0.3
0.8
V
2
Input Low Voltage
-0.3
---
V
°
C
°
C
2
Ambient Temperature (Commercial Range Versions)
0
25
70
3
Ambient Temperature (Industrial Range Versions)
-40
25
85
3
相關(guān)PDF資料
PDF描述
GS840H18 4Mb（256K x 18Bit) Synchronous Burst SRAM(4M位（256K x 18位）同步靜態(tài)RAM（帶2位脈沖地址計(jì)數(shù)器）)
GS840H36 4Mb（128K x 36Bit) Synchronous Burst SRAM(4M位（128K x 36位）同步靜態(tài)RAM（帶2位脈沖地址計(jì)數(shù)器）)
GS8644Z18E-133I CONN 2MM SKT 22POS THRU-BRD SMD
GS8644Z18E-150 CONN 2MM SKT 24POS THRU-BRD SMD
GS8644Z18E-150I CONN 2MM SKT 24POS THRU-BRD SMD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
GS840H32AB-100 制造商:GSI 制造商全稱:GSI Technology 功能描述:256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs
GS840H32AB-100I 制造商:GSI 制造商全稱:GSI Technology 功能描述:256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs
GS840H32AB-150 制造商:GSI Technology 功能描述:2.5 OR 3.3V - Trays
GS840H32AB-150I 制造商:GSI Technology 功能描述:2.5 OR 3.3V - Trays
GS840H32AB-166 制造商:GSI 制造商全稱:GSI Technology 功能描述:256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs
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