參數(shù)資料
型號: GS8644ZV18E-200I
廠商: GSI TECHNOLOGY
元件分類: DRAM
英文描述: 72Mb Pipelined and Flow Through Synchronous NBT SRAM
中文描述: 4M X 18 ZBT SRAM, 6.5 ns, PBGA165
封裝: 15 X 17 MM, 1 MM PITCH, FBGA-165
文件頁數(shù): 5/37頁
文件大?。?/td> 776K
代理商: GS8644ZV18E-200I
Product Preview
GS8644ZV18(B/E)/GS8644ZV36(B/E)/GS8644ZV72(C)
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.03 11/2004
5/37
2003, GSI Technology
GS8644ZV36B Pad Out—119-Bump BGA—Top View (Package B)
1
2
3
4
5
6
7
A
V
DDQ
A
A
A
A
A
V
DDQ
A
B
NC
E2
A
ADV
A
E3
NC
B
C
NC
A
A
V
DD
A
A
NC
C
D
DQC
DQPC
V
SS
ZQ
V
SS
DQPB
DQB
D
E
DQC
DQC
V
SS
E1
V
SS
DQB
DQB
E
F
V
DDQ
DQC
V
SS
G
V
SS
DQB
V
DDQ
F
G
DQC
DQC
BC
A
BB
DQB
DQB
G
H
DQC
DQC
V
SS
W
V
SS
DQB
DQB
H
J
V
DDQ
V
DD
NC
V
DD
NC
V
DD
V
DDQ
J
K
DQD
DQD
V
SS
CK
V
SS
DQA
DQA
K
L
DQD
DQD
BD
NC
BA
DQA
DQA
L
M
V
DDQ
DQD
V
SS
CKE
V
SS
DQA
V
DDQ
M
N
DQD
DQD
V
SS
A1
V
SS
DQA
DQA
N
P
DQD
DQPD
V
SS
A0
V
SS
DQPA
DQA
P
R
NC
A
LBO
V
DD
FT
A
NC
R
T
NC
A
A
A
A
A
ZZ
T
U
V
DDQ
TMS
TDI
TCK
TDO
NC
V
DDQ
U
7 x 17 Bump BGA—14 x 22 mm
2
Body—1.27 mm Bump Pitch
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