- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄370399 > GTL2007 (NXP Semiconductors N.V.) 13-bit GTL to LVTTL translator with power good control PDF資料下載
參數(shù)資料
| 型號(hào)： | GTL2007 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 13-bit GTL to LVTTL translator with power good control |
| 中文描述： | 13位的GTL的LVTTL有良好的控制權(quán)翻譯 |
| 文件頁(yè)數(shù)： | 17/19頁(yè) |
| 文件大?。?/td> | 92K |
| 代理商： | GTL2007 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)當(dāng)前第17頁(yè)第18頁(yè)第19頁(yè)
9397 750 13264
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 2 June 2005
17 of 19
Philips Semiconductors
GTL2007
13-bit GTL to LVTTL translator with power good control
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
16. Abbreviations
17. Revision history
Table 15:
Acronym
CDM
CMOS
CPU
ESD
GTL
HBM
LVTTL
MM
PRR
TTL
VRD
Abbreviations
Description
Charged Device Model
Complementary Metal Oxide Silicon
Central Processing Unit
Electrostatic Discharge
Gunning Transceiver Logic
Human Body Model
Low Voltage Transistor-Transistor Logic
Machine Model
Pulse Rate Repetition
Transistor-Transistor Logic
Voltage Regulator Down
Table 16:
Document ID
GTL2007_1
Revision history
Release date
20050602
Data sheet status
Product data sheet
Change notice
-
Doc. number
9397 750 13264
Supersedes
-
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| GTLP16612AA | 18-Bit Bus Transceiver |
| GTLP16612MEAX | 18-Bit Bus Transceiver |
| GTLP16612MTDX | 18-Bit Bus Transceiver |
| GTLP16616MEAX | Bus Transceiver |
| GTLP16616MTDX | Bus Transceiver |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| GTL2007PW | 功能描述:轉(zhuǎn)換 - 電壓電平 12-BIT XEON GTL TO LVTTL TRANS RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| GTL2007PW,112 | 功能描述:轉(zhuǎn)換 - 電壓電平 12-BIT XEON GTL TO RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| GTL2007PW,118 | 功能描述:轉(zhuǎn)換 - 電壓電平 12BIT XEON GTL/LVTTL RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| GTL2007PW-T | 功能描述:轉(zhuǎn)換 - 電壓電平 12BIT XEON GTL/LVTTL RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| GTL2008 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:12-bit GTL to LVTTL translator with power good control and high-impedance LVTTL and GTL outputs |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。