
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : IC200407
Issued Date : 2003.04.01
Revised Date : 2005.03.25
Page No. : 6/7
H34063AP, H34063AS
HSMC Product Specification
DIP-8 Dimension
SO-8 Dimension
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
A
B
8
7
6
5
4
3
2
1
H
I
F
G
J
K
M
L
α
1
E
D
C
8-Lead DIP-8
Plastic Package
HSMC Package Code: P
Marking:
Date Code
Control Code
H
3 4 0 6 3 A
P
Pb Free Mark
Pb-Free: "
.
"
(Note)
Normal: None
Note: Green
label is used for pb-free packing
Pin Style: 1.SWC 2.SWE 3.TC 4.GND
5.FB 6.VCC 7.Ipk 8.DRC
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
α
1
Min.
6.29
9.22
-
-
-
3.25
3.17
0.38
2.28
7.49
-
8.56
0.229
94
o
Max.
6.40
9.32
*1.52
*1.27
*0.99
3.35
3.55
0.53
2.79
7.74
*3.00
8.81
0.381
97
o
*: Typical, Unit: mm
A
B
F
C
D
E
G
Part A
I
H
J
K
O
M
L
N
Part A
2
3
4
5
6
7
8
Pin1 Index
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
Min.
4.85
3.85
5.80
1.22
0.37
3.74
1.45
4.80
0.05
0.30
0.19
0.37
0.23
0.08
0.00
Max.
5.10
3.95
6.20
1.32
0.47
3.88
1.65
5.10
0.20
0.70
0.25
0.52
0.28
0.13
0.15
*: Typical, Unit: mm
Marking:
Date Code
Control Code
Pin 1 Index
H
3 4 0
S
Pb Free Mark
Pb-Free: "
.
"
(Note)
Normal: None
6 3 A
Note: Green
label is used for pb-free packing
Pin Style: 1.SWC 2.SWE 3.TC 4.GND
5.FB 6.VCC 7.Ipk 8.DRC
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
8-Lead SO-8 Plastic
Surface Mounted Package
HSMC Package Code: S