參數(shù)資料
型號(hào)： HA7-5002-2
廠商： HARRIS SEMICONDUCTOR
元件分類： 運(yùn)動(dòng)控制電子
英文描述： 110MHz, High Slew Rate, High Output Current Buffer
中文描述： BUFFER AMPLIFIER, CDIP8
文件頁(yè)數(shù)： 11/13頁(yè)
文件大?。?/td> 820K
代理商： HA7-5002-2
11
Plastic Leaded Chip Carrier Packages (PLCC)
A1
A
SEATING
PLANE
0.020 (0.51)
MIN
VIEW “A”
D2/E2
0.025 (0.64)
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
E
E1
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
C
D1
D
0.020 (0.51) MAX
3 PLCS
0.026 (0.66)
0.032 (0.81)
0.045 (1.14)
MIN
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
VIEW “A” TYP.
0.004 (0.10)
C
-C-
D2/E2
C
NOTES:
17. Controlling dimension: INCH. Converted millimeter dimensions
are not necessarily exact.
18. Dimensions and tolerancing per ANSI Y14.5M-1982.
19. Dimensions D1 and E1 do not include mold protrusions. Allowable
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
20. To be measured at seating plane
21. Centerline to be determined where center leads exit plastic body.
22. “N” is the number of terminal positions.
contact point.
-C-
N20.35
(JEDEC MS-018AA ISSUE A)
20 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.165
0.180
4.20
4.57
-
A1
0.090
0.120
2.29
3.04
-
D
0.385
0.395
9.78
10.03
-
D1
0.350
0.356
8.89
9.04
3
D2
0.141
0.169
3.59
4.29
4, 5
E
0.385
0.395
9.78
10.03
-
E1
0.350
0.356
8.89
9.04
3
E2
0.141
0.169
3.59
4.29
4, 5
N
20
20
6
Rev. 2 11/97
HA-5002
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