參數(shù)資料
型號(hào): HA9P5127-5Z
廠商: Intersil
文件頁數(shù): 4/12頁
文件大?。?/td> 0K
描述: IC OPAMP 8.5MHZ PRECISION 8-SOIC
標(biāo)準(zhǔn)包裝: 98
放大器類型: 通用
電路數(shù): 1
轉(zhuǎn)換速率: 10 V/µs
增益帶寬積: 8.5MHz
電流 - 輸入偏壓: 15nA
電壓 - 輸入偏移: 30µV
電流 - 電源: 3.5mA
電流 - 輸出 / 通道: 25mA
電壓 - 電源,單路/雙路(±): 10 V ~ 30 V,±5 V ~ 15 V
工作溫度: 0°C ~ 75°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SOIC
包裝: 管件
產(chǎn)品目錄頁面: 1234 (CN2011-ZH PDF)
12
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN2906.8
November 29, 2011
HA-5127, HA-5127A
Ceramic Dual-In-Line Frit Seal Packages (CERDIP)
NOTES:
1. Index area: A notch or a pin one identification mark shall be locat-
ed adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark.
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
5. This dimension allows for off-center lid, meniscus, and glass
overrun.
6. Dimension Q shall be measured from the seating plane to the
base plane.
7. Measure dimension S1 at all four corners.
8. N is the maximum number of terminal positions.
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
10. Controlling dimension: INCH
bbb
C A - B
S
c
Q
L
A
SEATING
BASE
D
PLANE
-D-
-A-
-C-
-B-
α
D
E
S1
b2
b
A
e
M
c1
b1
(c)
(b)
SECTION A-A
BASE
LEAD FINISH
METAL
eA/2
A
M
S
ccc
C A - B
M
D
S
aaa
CA - B
M
D
S
eA
F8.3A MIL-STD-1835 GDIP1-T8 (D-4, CONFIGURATION A)
8 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.200
-
5.08
-
b
0.014
0.026
0.36
0.66
2
b1
0.014
0.023
0.36
0.58
3
b2
0.045
0.065
1.14
1.65
-
b3
0.023
0.045
0.58
1.14
4
c
0.008
0.018
0.20
0.46
2
c1
0.008
0.015
0.20
0.38
3
D
-
0.405
-
10.29
5
E
0.220
0.310
5.59
7.87
5
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
-
eA/2
0.150 BSC
3.81 BSC
-
L
0.125
0.200
3.18
5.08
-
Q
0.015
0.060
0.38
1.52
6
S1
0.005
-
0.13
-
7
α
90o
105o
90o
105o
-
aaa
-
0.015
-
0.38
-
bbb
-
0.030
-
0.76
-
ccc
-
0.010
-
0.25
-
M
-
0.0015
-
0.038
2, 3
N8
8
Rev. 0 4/94
相關(guān)PDF資料
PDF描述
HA9P5320-5Z IC AMP SAMPLE&HOLD 2MHZ 16-SOIC
HC1000-0.020-02-0404 THERMAL PAD 20MIL 4X4 GAPPAD
HF115AC-0.0055-AC-54 THERM PAD TO-220 W/ADH HI-FLOW
HFA1100IBZ IC OP AMP 850MHZ CFB 8-SOIC
HFA1110IBZ IC BUFFER C-LOOP 750MHZ LD 8SOIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HA9P5127-5ZX96 功能描述:精密放大器 W/ANL OPAMP 8 5MHZ VFB PRECISION COM RoHS:否 制造商:Maxim Integrated 每芯片的通道數(shù)量: 輸入補(bǔ)償電壓:0.25 mV at +/- 5 V 輸入電壓范圍(最大值): 安裝風(fēng)格: 封裝 / 箱體:SOIC-8 Narrow 封裝:Tube
HA9P5137-5 WAF 制造商:Intersil Corporation 功能描述:
HA9P5137B4738 制造商:Rochester Electronics LLC 功能描述:- Bulk
HA9P5141-5 制造商:Harris Corporation 功能描述:
HA9P5142-5 制造商:Rochester Electronics LLC 功能描述:- Bulk