參數(shù)資料
型號: HCS139HMSR
廠商: HARRIS SEMICONDUCTOR
元件分類: 通用總線功能
英文描述: Radiation Hardened Dual 2-to-4 Line Decoder/Demultiplexer
中文描述: HC/UH SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, UUC16
文件頁數(shù): 9/9頁
文件大?。?/td> 171K
代理商: HCS139HMSR
161
HCS139MS
Die Characteristics
DIE DIMENSIONS:
106 mils x 108 mils x 19 mils 1 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 mils x 4 mils
Metallization Mask Layout
HCS139MS
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS139 is TA14309A.
(
(
(
(
(14) 2A0
(13) 2A1
(12) 2Y0
(11) 2Y1
1
G
2
(10) 2Y2
1A1 (3)
1Y0 (4)
1Y1 (5)
1Y2 (6)
Spec Number
518832
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