參數(shù)資料
型號: HCS165KMSR
廠商: HARRIS SEMICONDUCTOR
元件分類: 通用總線功能
英文描述: Radiation Hardened Inverting 8-Bit Parallel-Input/Serial Output Shift Register
中文描述: HC/UH SERIES, 8-BIT RIGHT PARALLEL IN SERIAL OUT SHIFT REGISTER, COMPLEMENTARY OUTPUT, CDFP16
文件頁數(shù): 9/9頁
文件大?。?/td> 225K
代理商: HCS165KMSR
248
HCS165MS
Die Characteristics
DIE DIMENSIONS:
95 x 94 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
< 2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 x 4 mils
Metallization Mask Layout
HCS165MS
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS165 is TA14385A.
CP
(2)
PL
(1)
VCC
(16)
D4 (3)
D5 (4)
D6 (5)
(6)
D7
(8)
GND
(9)
Q7
(10)
DS
(11) D0
(12) D1
(13) D2
(14)
(7)
Q7
(15)
D3
CE
Spec Number
518757
相關(guān)PDF資料
PDF描述
HCS165HMSR Radiation Hardened Inverting 8-Bit Parallel-Input/Serial Output Shift Register
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參數(shù)描述
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HCS166HMSR 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened 8-Bit Parallel-Input/Serial Output Shift Register
HCS166K 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened 8-Bit Parallel-Input/Serial Output Shift Register