參數(shù)資料
型號(hào): HCS166MS
廠商: Intersil Corporation
英文描述: Radiation Hardened 8-Bit Parallel-Input/Serial Output Shift Register(抗輻射8位并入串出移位寄存器)
中文描述: 輻射加固8位Parallel-Input/Serial輸出移位寄存器(抗輻射8位并入串出移位寄存器)
文件頁(yè)數(shù): 9/9頁(yè)
文件大?。?/td> 227K
代理商: HCS166MS
258
HCS166MS
Die Characteristics
DIE DIMENSIONS:
94 x 94 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
< 2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 mils x 4 mils
Metallization Mask Layout
HCS166MS
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS166 is TA14386A.
DS
(1)
D0
(2)
D1
(3)
D2 (4)
D3 (5)
CE (6)
(7)
CP
(8)
GND
(9)
MR
(10)
D4
(11)
D5
VCC
(16)
PE
(15)
(14) D7
(13) Q7
(12) D6
Spec Number
518758
相關(guān)PDF資料
PDF描述
HCS166D Radiation Hardened 8-Bit Parallel-Input/Serial Output Shift Register
HCS166DMSR Radiation Hardened 8-Bit Parallel-Input/Serial Output Shift Register
HCS166K Radiation Hardened 8-Bit Parallel-Input/Serial Output Shift Register
HCS166KMSR Radiation Hardened 8-Bit Parallel-Input/Serial Output Shift Register
HCS190HMSR Radiation Hardened Synchronous 4-Bit Up/Down Counter
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