參數(shù)資料
型號(hào): HCS195DMSR
廠商: HARRIS SEMICONDUCTOR
元件分類: 通用總線功能
英文描述: Radiation Hardened Inverting 8-Bit Parallel-Input/Serial Output Shift Register
中文描述: HC/UH SERIES, 4-BIT RIGHT PARALLEL IN PARALLEL OUT SHIFT REGISTER, TRUE OUTPUT, CDIP16
文件頁(yè)數(shù): 6/9頁(yè)
文件大小: 229K
代理商: HCS195DMSR
285
Specifications HCS195MS
TABLE 6. APPLICABLE SUBGROUPS
CONFORMANCE GROUPS
METHOD
GROUP A SUBGROUPS
READ AND RECORD
Initial Test (Preburn-In)
100%/5004
1, 7, 9
ICC, IOL/H
Interim Test
I
(Postburn-In)
100%/5004
1, 7, 9
ICC, IOL/H
Interim Test
II
(Postburn-In)
100%/5004
1, 7, 9
ICC, IOL/H
PDA
100%/5004
1, 7, 9, Deltas
Interim Test
III
(Postburn-In)
100%/5004
1, 7, 9
ICC, IOL/H
PDA
100%/5004
1, 7, 9, Deltas
Final Test
100%/5004
2, 3, 8A, 8B, 10, 11
Group A (Note 1)
Sample/5005
1, 2, 3, 7, 8A, 8B, 9, 10, 11
Group B
Subgroup B-5
Sample/5005
1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas
Subgroups 1, 2, 3, 9, 10, 11,
(Note 2)
Subgroup B-6
Sample/5005
1, 7, 9
Group D
Sample/5005
1, 7, 9
NOTES:
1. Alternate Group A testing in accordance with method 5005 of MIL-STD-883 may be exercised.
2. Table 5 parameters only.
TABLE 7. TOTAL DOSE IRRADIATION
CONFORMANCE
GROUPS
METHOD
TEST
READ AND RECORD
PRE RAD
POST RAD
PRE RAD
POST RAD
Group E Subgroup 2
5005
1, 7, 9
Table 4
1,9
Table 4 (Note 1)
NOTE:
1. Except FN test which will be performed 100% Go/No-Go.
TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS
OPEN
GROUND
1/2 VCC = 3V
±
0.5V
VCC = 6V
±
0.5V
OSCILLATOR
50kHz
25kHz
STATIC BURN-IN I TEST CONNECTIONS (Note 1)
11 - 15
1 - 10
-
16
-
-
STATIC BURN-IN II TEST CONNECTIONS (Note 1)
11 - 15
8
-
1 - 7, 9 - 10, 16
-
-
DYNAMIC BURN-IN TEST CONNECTIONS (Note 2)
-
8, 9
1 - 3, 16
11 - 15
10
4 - 7
NOTES:
1. Each pin except VCC and GND will have a resistor of 10k
±
5% for static burn-in
2. Each pin except VCC and GND will have a resistor of 1k
±
5% for dynamic burn-in
TABLE 9. IRRADIATION TEST CONNECTIONS
OPEN
GROUND
VCC = 5V
±
0.5V
11 - 15
8
1 - 7, 9 - 10, 16
NOTE: Each pin except VCC and GND will have a resistor of 47K
5% for irradiation testing.
Group E, Subgroup 2, sample size is 4 dice/wafer 0 failures.
Spec Number
518760
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