參數(shù)資料
型號: HCS273K
廠商: Intersil Corporation
英文描述: Radiation Hardened Octal D Flip-Flop
中文描述: 輻射加固八路D觸發(fā)器
文件頁數(shù): 9/9頁
文件大小: 139K
代理商: HCS273K
344
HCS273MS
Die Characteristics
DIE DIMENSIONS:
108 x 106 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 mils x 4 mils
Metallization Mask Layout
HCS273MS
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS273 is TA14307B.
MR
(1)
Q0
(2)
D0
(3)
VCC
(20)
Q7
(19)
(18) D7
(17) D6
(16) Q6
(15) Q5
(14) D5
D1 (4)
Q1 (5)
Q2 (6)
D2 (7)
(8)
D3
(9)
Q3
(10)
GND
(11)
CP
(12)
Q4
(13)
D4
Spec Number
518767
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HCS273KMSR 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal D Flip-Flop
HCS273MS 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal D Flip-Flop
HCS27D 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Triple 3-Input NOR Gate
HCS27DMSR 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Triple 3-Input NOR Gate
HCS27HMSR 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Triple 3-Input NOR Gate