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參數(shù)資料
| 型號： | HCS374MS |
| 廠商： | Intersil Corporation |
| 英文描述： | Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered(三態(tài),正邊沿觸發(fā),抗輻射八D觸發(fā)器) |
| 中文描述： | 輻射加固八路D類觸發(fā)器，三態(tài)，上升沿觸發(fā)（三態(tài)，正邊沿觸發(fā)，抗輻射八?觸發(fā)器） |
| 文件頁數(shù)： | 10/10頁 |
| 文件大?。?/td> | 175K |
| 代理商： | HCS374MS |
367
HCS374MS
Die Characteristics
DIE DIMENSIONS:
108 x 106 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
< 2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 mils x 4 mils
Metallization Mask Layout
HCS374MS
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS374 is TA14304B.
D1 (4)
Q1 (5)
Q2 (6)
D2 (7)
(8)
D3
(9)
Q3
(10)
Q4
(11)
CP
(12)
Q4
(13)
D4
(18) D7
(17) D6
(16) Q6
(15) Q5
(14) D5
Q0
(2)
D0
(3)
OE
(1)
VCC
(20)
Q7
(19)
Spec Number
518770
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HCS374D | Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered |
| HCS374DMSR | Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered |
| HCS374K | Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered |
| HCS374KMSR | Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HCS374MS_04 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered |
| HCS3920FT1L00 | 制造商:SEI Stackpole Electronics Inc 功能描述:RES SHUNT 0.001 OHM 1% 5W |
| HCS3920FTL300 | 制造商:SEI Stackpole Electronics Inc 功能描述:RES SHUNT 0.0003 OHM 1% 5W |
| HCS3920FTL500 | 制造商:SEI Stackpole Electronics Inc 功能描述:RES SHUNT 0.0005 OHM 1% 5W |
| HCS410 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:KEELOQ? Code Hopping Encoder and Transponder 2-bit CRC, 2-bit queue |
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