參數(shù)資料
型號: HCS473ISLSQTP
廠商: Microchip Technology Inc.
英文描述: IC EEPROM SPI BUS 1KBIT 8-SOIC
中文描述: 跳碼編碼器和轉(zhuǎn)發(fā)器
文件頁數(shù): 4/68頁
文件大?。?/td> 1629K
代理商: HCS473ISLSQTP
HCS473
DS40035C-page 2
Preliminary
2002 Microchip Technology Inc.
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
INDEX.................................................................................................................................................................................................. 61
On-Line Support................................................................................................................................................................................... 62
Systems Information and Upgrade Hot Line........................................................................................................................................ 62
Reader Response................................................................................................................................................................................ 63
Product Identification System............................................................................................................................................................... 64
General Description ..................................................................................................................................................................... 3
Device Description ...................................................................................................................................................................... 5
Device Operation ....................................................................................................................................................................... 11
Programming Specification ....................................................................................................................................................... 37
Integrating the HCS473 Into A System ..................................................................................................................................... 39
Development Support................................................................................................................................................................. 43
Electrical Characteristics ........................................................................................................................................................... 49
Packaging Information................................................................................................................................................................ 57
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