參數(shù)資料
型號(hào): HCS74K
廠商: Intersil Corporation
英文描述: Radiation Hardened Dual-D Flip-Flop with Set and Reset
中文描述: 雙輻射加固與設(shè)置和復(fù)位- D觸發(fā)器
文件頁(yè)數(shù): 9/9頁(yè)
文件大?。?/td> 175K
代理商: HCS74K
91
HCS74MS
Die Characteristics
DIE DIMENSIONS:
89 x 88 mils
2.25 x 2.24mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 x 4 mils
Metallization Mask Layout
HCS74MS
R1
(1)
VCC
(14)
CP1 (3)
S1 (4)
Q1 (5)
Q1 (6)
(8)
Q2
(9)
Q2
(10) S2
(11) CP2
(12) D2
(13) R2
D1
(2)
NC
NC
(7)
GND
Spec Number
518772
相關(guān)PDF資料
PDF描述
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參數(shù)描述
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