參數(shù)資料
型號: HCTS153MS
廠商: Intersil Corporation
英文描述: Radiation Hardened Dual 4-Input Multiplexer
中文描述: 輻射加固雙路4輸入復(fù)用器
文件頁數(shù): 9/10頁
文件大?。?/td> 138K
代理商: HCTS153MS
548
HCTS153MS
Die Characteristics
DIE DIMENSIONS:
2.13mm x 2.13mm
84 mils x 84 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 mils x 4 mils
Metallization Mask Layout
HCTS153MS
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS153 is TA14469A.
S1
(2)
1E
(1)
VCC
(16)
1I3 (3)
1I2 (4)
1I1 (5)
1I0 (6)
(8)
GND
(9)
Y2
(11) 2I1
(12) 2I2
(13) 2I3
(14) S0
(10) 2I0
(7)
Y1
2E
(15)
Spec Number
518609
相關(guān)PDF資料
PDF描述
HCTS153HMSR Radiation Hardened Dual 4-Input Multiplexer
HCTS157DMSR Radiation Hardened Quad 2-Input Multiplexers
HCTS157MS Radiation Hardened Quad 2-Input Multiplexers
HCTS157KMSR Radiation Hardened Quad 2-Input Multiplexers
HCTS157D Triple 3-Input Positive-AND Gates 20-LCCC -55 to 125
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