參數(shù)資料
型號: HCTS20MS
廠商: Intersil Corporation
英文描述: Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125
中文描述: 輻射加固雙路4輸入與非門
文件頁數(shù): 8/9頁
文件大小: 132K
代理商: HCTS20MS
427
HCTS20MS
Die Characteristics
DIE DIMENSIONS:
2.20 x 2.24(mm)
METALLIZATION:
Type: SiAl
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 mils x 4 mils
Metallization Mask Layout
HCTS20MS
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS20 is TA14426A.
A1
(1)
VCC
(14)
D2
(13)
B1 (2)
NC (3)
C1 (4)
D1 (5)
(6)
Y1
(7)
GND
(8)
Y2
(9) A2
(10) B2
(11) NC
(12) C2
Spec Number
518619
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