參數(shù)資料
型號: HCTS244DTR
廠商: INTERSIL CORP
元件分類: 通用總線功能
英文描述: Radiation Hardened Octal Buffer/Line Driver, Three-State
中文描述: HCT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDIP20
封裝: SIDE BRAZED, CERAMIC, DIP-20
文件頁數(shù): 10/10頁
文件大?。?/td> 192K
代理商: HCTS244DTR
611
HCTS244MS
Die Characteristics
DIE DIMENSIONS:
108 x 106 mils
METALLIZATION:
Type: Al/Sil
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 mils x 4 mils
Metallization Mask Layout
HCTS244MS
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS244 is TA14402A.
1OE
(1)
2OE
(19)
VCC
(20)
1A0
(2)
1A1 (4)
2Y3
(3)
2Y2 (5)
1A2 (6)
2Y1 (7)
(8)
1A3
(9)
2Y0
(10)
GND
(11)
2A0
(12)
1Y3
(13)
2A1
(14) 1Y2
(15) 2A2
(16) 1Y1
(17) 2A3
(18) 1Y0
Spec Number
518616
相關PDF資料
PDF描述
HCTS244K Radiation Hardened Octal Buffer/Line Driver, Three-State
HCTS273KMSR Radiation Hardened Octal D Flip-Flop
HCTS273K Radiation Hardened Octal D Flip-Flop
HCTS273MS Radiation Hardened Octal D Flip-Flop
HCTS273D Radiation Hardened Octal D Flip-Flop
相關代理商/技術參數(shù)
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HCTS244MS 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal Buffer/Line Driver, Three-State