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參數(shù)資料
| 型號： | HCTS273K |
| 廠商： | Intersil Corporation |
| 英文描述： | Radiation Hardened Octal D Flip-Flop |
| 中文描述： | 輻射加固八路D觸發(fā)器 |
| 文件頁數(shù)： | 9/10頁 |
| 文件大小： | 281K |
| 代理商： | HCTS273K |
9
HCTS273MS
Die Characteristics
DIE DIMENSIONS:
108 x 106 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 x 4 mils
Metallization Mask Layout
HCTS273MS
NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS273 is TA14407.
MR
(1)
Q0
(2)
D0
(3)
VCC
(20)
Q7
(19)
D1 (4)
Q1 (5)
Q2 (6)
D2 (7)
(8)
D3
(9)
Q3
(10)
GND
(11)
CP
(12)
Q4
(13)
D4
(14) D5
(15) Q5
(16) Q6
(17) D6
(18) D7
Spec Number
518642
相關PDF資料 |
PDF描述 |
|---|---|
| HCTS273MS | Radiation Hardened Octal D Flip-Flop |
| HCTS273D | Radiation Hardened Octal D Flip-Flop |
| HCTS273DMSR | 512 x 36 x 2 Synchronous Bidirectional FIFO Memory 132-CFP -55 to 125 |
| HCTS273HMSR | Radiation Hardened Octal D Flip-Flop |
| HCTS27DMSR | Radiation Hardened Triple 3-Input NOR Gate |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| HCTS273KMSR | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal D Flip-Flop |
| HCTS273MS | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal D Flip-Flop |
| HCTS27D | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Triple 3-Input NOR Gate |
| HCTS27DMSR | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Triple 3-Input NOR Gate |
| HCTS27HMSR | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Triple 3-Input NOR Gate |
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