參數(shù)資料
型號: HCTS373KTR
廠商: HARRIS SEMICONDUCTOR
元件分類: 通用總線功能
英文描述: Radiation Hardened Octal Transparent Latch, Three-State
中文描述: HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20
文件頁數(shù): 10/11頁
文件大?。?/td> 277K
代理商: HCTS373KTR
647
HCTS373MS
Die Characteristics
DIE DIMENSIONS:
108 x 106 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 x 4 mils
Metallization Mask Layout
HCTS373MS
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS373 is TA14403A.
OE
(1)
Q7
(19)
VCC
(20)
Q0
(2)
D1 (4)
D0
(3)
Q1 (5)
Q2 (6)
D2 (7)
(8)
D3
(9)
Q3
(10)
GND
(11)
LE
(12)
Q4
(13)
D4
(14) D5
(15) Q5
(16) Q6
(17) D6
(18) D7
Spec Number
518636
相關(guān)PDF資料
PDF描述
HCTS374HMSR Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered
HCTS374KTR Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered
HCTS374D Octal D-type Transparent Latches With 3-State Outputs 20-CDIP -55 to 125
HCTS374DMSR Octal D-type Transparent Latches With 3-State Outputs 20-CFP -55 to 125
HCTS374DTR Dual Positive-Edge-Triggered D-type Flip-Flops With Clear And Preset 20-LCCC -55 to 125
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HCTS373MS 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal Transparent Latch, Three-State
HCTS373T 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal Transparent Latch, Three-State
HCTS374D 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered
HCTS374DMSR 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered
HCTS374DTR 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered