參數(shù)資料
型號: HCTS374MS
廠商: Intersil Corporation
英文描述: Dual Positive-Edge-Triggered D-type Flip-Flops With Clear And Preset 14-CFP -55 to 125
中文描述: 輻射加固八路D類觸發(fā)器,三態(tài),上升沿觸發(fā)
文件頁數(shù): 10/11頁
文件大小: 183K
代理商: HCTS374MS
659
HCTS374MS
Die Characteristics
DIE DIMENSIONS:
108 x 106 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 mils x 4 mils
Metallization Mask Layout
HCTS374MS
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS374 is TA14404A.
OE
(1)
Q0
(2)
D1 (4)
Q1 (5)
Q2 (6)
D2 (7)
GND
(10)
CP
(11)
Q4
(12)
(15) Q5
(16) Q6
(17) D6
(18) D7
Q7
(19)
VCC
(20)
(14) D5
D0
(3)
D3
(8)
Q3
(9)
D4
(13)
Spec Number
518635
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