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參數(shù)資料
| 型號(hào)： | HCTS574D |
| 廠商： | Intersil Corporation |
| 英文描述： | Hex Inverters 14-CDIP -55 to 125 |
| 中文描述： | 輻射加固八路D類(lèi)觸發(fā)器，三態(tài)，上升沿觸發(fā) |
| 文件頁(yè)數(shù)： | 10/11頁(yè) |
| 文件大?。?/td> | 135K |
| 代理商： | HCTS574D |
703
HCTS574MS
Die Characteristics
DIE DIMENSIONS:
101 x 85 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 mils x 4 mils
Metallization Mask Layout
HCTS574MS
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS574 is TA14460A.
OE
(1)
D0
(2)
D1 (3)
D2 (4)
D4 (6)
D6 (8)
D7
(9)
GND
(10)
Q7
(12)
(14) Q5
(16) Q3
(17) Q2
(18) Q1
Q0
(19)
VCC
(20)
(13) Q6
(15) Q4
CP
(11)
D5 (7)
D3 (5)
Spec Number
518629
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HCTS574DMSR | Hex Inverters 14-CFP -55 to 125 |
| HCTS574K | Hex Inverters 20-LCCC -55 to 125 |
| HCTS574KMSR | Hex Inverters 14-CDIP -55 to 125 |
| HCTS574MS | Hex Inverters 14-CFP -55 to 125 |
| HCTS646KMSR | Radiation Hardened Octal Bus Transceiver/Register, Three-State |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HCTS574DMSR | 制造商:INTERSIL 制造商全稱(chēng):Intersil Corporation 功能描述:Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered |
| HCTS574HMSR | 制造商:INTERSIL 制造商全稱(chēng):Intersil Corporation 功能描述:Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered |
| HCTS574K | 制造商:INTERSIL 制造商全稱(chēng):Intersil Corporation 功能描述:Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered |
| HCTS574KMSR | 制造商:INTERSIL 制造商全稱(chēng):Intersil Corporation 功能描述:Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered |
| HCTS574MS | 制造商:INTERSIL 制造商全稱(chēng):Intersil Corporation 功能描述:Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered |
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