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| 型號： | HD64F2314 |
| 英文描述： | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| 中文描述： | 微機開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊/交叉工具的性能 |
| 文件頁數(shù)： | 40/67頁 |
| 文件大?。?/td> | 382K |
| 代理商： | HD64F2314 |
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Rev. 2.0, 03/06/02, 36
3.
Advanced Build Features
This chapter explains the more advanced build concepts.
3.1
The Build Process Revisited
Chapter 2, “Build Basics” began by describing the build process in terms of a compiler, an assembler and a
linker (figure 2.1). This will be the case for most installations of the Hitachi Embedded Workshop. However, if
you want to begin changing the build process (e.g. adding and removing phases) then it is important to
understand more about the way in which a build functions.
3.1.1
What is a Build?
Building a project means applying a set of tools upon certain input files in order to produce the desired output.
Thus, we apply a compiler upon C/C++ source files in order to create object files, we apply an assembler upon
assembler source files in order to create object files and so forth. At each step or “phase” of the build, we apply a
different tool upon a different set of input files. Figure 3.1 presents another view of the build process.
BEGIN
END
PHASE 1
PHASE 2
PHASE 3
PHASE X
Phase 1 Output Files
Phase 2 Output Files
Phase 1 Input Files
Phase 2 Input Files
Phase 3 Output Files
Phase X Output Files
Phase 3 Input Files
Phase X Input Files
Figure 3.1: Build Process
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HD64F2315 | H8S/2319.H8S/2318 Series Hardware Manual |
| HD64F2317 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| HD64F2318 | H8S/2319.H8S/2318 Series Hardware Manual |
| HD64F2319 | F-ZTAT Microcomputer On-Board Programming Application Note |
| HD64F2326 | H8S.H8/300 Series Simulator/Debugger User＇s Manual/Cross tool |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HD64F2317VTE25 | 制造商:Renesas Electronics Corporation 功能描述:MCU 3V 128K 100-TQFP - Trays |
| HD64F2317VTE25V | 制造商:Renesas Electronics Corporation 功能描述: |
| HD64F2318VF20 | 制造商:Renesas Electronics Corporation 功能描述: |
| HD64F2318VF25 | 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 3.3V 100PQFP - Trays |
| HD64F2318VF25V | 制造商:Renesas Electronics 功能描述:16 H8S/2300 25MHz 100QFP 256KB Tray |
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