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參數(shù)資料
| 型號： | HDDS020-557TG |
| 廠商： | ADVANCED INTERCONNECTIONS CORP |
| 元件分類： | 插座 |
| 英文描述： | DIP40, IC SOCKET |
| 文件頁數(shù)： | 2/4頁 |
| 文件大?。?/td> | 177K |
| 代理商： | HDDS020-557TG |
Board to Board
Interconnections
.050" (1.27mm) Pitch Board to Board Interconnections
Rev.14-A
Page59
inch/(mm)
BoardtoBoard
MaleTerminalInformation
FemaleTerminalInformation
ThruHole
Type-252**
Molded Only
ThruHole
Type-131
Peel-A-Way Only
.125
(3.18)
.125
(3.18)
.031
(.79)
.018 Dia.
(.46)
.018 Dia.
(.46)
.037 Dia.
(.94)
SurfaceMount
Type-526
Peel-A-Way Only
.040 Dia.
(1.02)
.018 Dia.
(.46)
.110
(2.79)
.050
(1.27)
SurfaceMount
Type-525
Peel-A-Way Only
.040 Dia.
(1.02)
.018 Dia.
(.46)
.129
(3.28)
.031
(.79)
ThruHole
Type-321
Peel-A-Way Only
.125
(3.18)
.125
(3.18)
.070
(1.78)
.018 Dia.
(.46)
.018 Dia.
(.46)
.037 Dia.
(.94)
.018
(.46) Sq.
.018
(.46) Sq.
.020 Dia.
(.51)
.020 Dia.
(.51)
.230
(5.84)
.110
(2.79)
.100
(2.54)
ThruHole
Type-253**
Molded Only
ThruHole
Type-322
Peel-A-Way Only
ThruHole
Type-233
Molded Only
.125
(3.18)
.125
(3.18)
.085
(2.16)
.018 Dia.
(.46)
.018 Dia.
(.46)
.037 Dia.
(.94)
.120
(3.04)
.110
(2.79)
.100
(2.54)
SurfaceMount
Type-553
Molded Only
.042 Dia.
(1.07)
.038 Dia.
(.97)
.161
(4.09)
SurfaceMount
Type-636*
Molded Only-PatentPending
SurfaceMount
Type-565*
Molded Only
.042 Dia.
(1.07)
.042 Dia.
(1.07)
.161
(4.09)
Solder
Preform
.095
(2.41)
.107
(2.71)
.095
(2.41)
.041 Dia.
(1.04)
.018 Dia.
(.46) Typ. 2
ThruHole
Type-205
Molded Only
.070
(1.78)
.278
(7.06)
.042 Dia.
(1.07)
.015 Dia.
(.38)
ThruHole
Type-227
Peel-A-Way Only
.034 Dia.
(.86)
.042 Dia.
(1.07)
.155
(3.94)
.015
(.38)
ThruHole
Type-168
Molded Only
.041 Dia.
(1.04)
.018 Dia.
(2.79)
.080
(2.03)
.165
(4.19)
SurfaceMount
Type-551
Molded Only
.042 Dia.
(1.07)
Additionalterminaltypesavailable.Seeterminalsectionfordetailedterminalinformation.
ThruHole
Type-347
Molded Only
**Formatingsocketconsultfactory.
5EnergyWay,P.O.Box1019,WestWarwick,RI02893USATel.800-424-9850/401-823-5200Fax401-823-8723Emailadvintcorp@aol.comInternethttp://www.advintcorp.com
ADVANCED
INTERCONNECTIONS
Peel-A-Waycoveredbypatentrightsissuedandorpending.*Patentsissuedand/orpending
.080
(2.03)
.110
(2.79)
.105
(2.67)
.018 Dia.
(.46)
.042 Dia.
(1.07)
.030
(0.76)Dia.
.117
(2.97)
EutecticSolderBall
.025 Dia.
(0.64)
.133
(3.38)
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