參數(shù)資料
型號: HDSP-U1xx
英文描述: 8 mm (0.31 inch) Ultra Mini Seven Segment Displays(8 mm (0.31 英寸)袖珍型LED七段段碼顯示器)
中文描述: 8毫米(0.31英寸)超小型七段顯示器(8毫米(0.31英寸)袖珍型的LED七段段碼顯示器)
文件頁數(shù): 2/2頁
文件大小: 32K
代理商: HDSP-U1XX
Table 2. Failure Rate Prediction
(I
F
= 30 mA DC)
Notes:
1. The point typical MTBF (which represents a 60% confidence level) is the total device hours divided by the number of failures.
In the case of zero failures, one failure is assumed for this calculation.
2. The 90% Confidence MTBF represents the minimum level of reliability performance which is expected from 90% of all
samples. This confidence interval is based on the statistics of the distribution of failures. The assumed distribution of failures
is exponential. This particular distribution is commonly used in describing useful life failures. Refer to MIL-STD-690B for
details on this methodology.
3. A failure is any LED which does not emit light.
Point Typical
Performance
[1]
in Time
Performance
in Time
[2]
( 90% Confidence)
Ambient
J unction
F ailure Rate
( %/1K Hours)
<2.22
<1.45
<0.92
<0.57
F ailure Rate
( %/1K Hours)
<5.11
<3.34
<2.13
<1.32
Temperature (
°
C)
55
45
35
25
Temperature (
°
C)
75
65
55
45
MTBF
[1]
>45,000
>69,000
>108,000
>174,000
MTBF
[2]
>20,000
>30,000
>47,000
>76,000
Table 3. E nvironmental Tests
Test Name
Temperature
Cycle
Solder Heat
Resistance
Solderability
Resistance to
Solvents
[4]
MIL-STD-883C Ref
1010
Test Conditions
-30
°
C to 90
°
C, 15 min. dwell, 5 min.
transfer, 100 cycles
260
°
C, 3 seconds
Units Tested
132
Units Failed
0
2003
500
0
2003
MIL-STD-750
Method 1022
230
°
C, 10 seconds
TCA, 3 min. US bath, cotton
swab, rub 3x
23
11
0
0
Note:
4. This test is for marking only, not for
device functionality.
Test Name
ESD
MIL-STD-883C Ref
3015.2
Test Conditions
100 pF, 1.5 k
,
±
2000 volts
200 pF, 0
,
±
200 volts
Units Tested
11
11
Units Failed
0
0
Test Name
Vibration Variable
Frequency
Terminal Strength
Lead Fatigue
Physical
Dimensions
MIL-STD-883C Ref
2007
Test Conditions
2 hrs for each X, Y, Z axis at 20 Gs,
10 - 2000 Hz; 20 min. sweep
0.5 lb. for 30 sec.
Bend 90
°
, 2x
Check physical dimensions
Units Tested
22
Units Failed
0
2004 Condition A
2004 Condition B
2016
11
11
23
0
0
0
Table 5. E lectrical Tests
Table 4. Mechanical Tests
www.semiconductor.agilent.com
Data subject to change.
Copyright 1999 Agilent Technologies, Inc.
5091-9422E (11/99)
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