參數(shù)資料
型號(hào): HDSP-Uxxx
英文描述: Seven Segment Displays Ultra mini, 0.3 mini, 0.3 inch(超袖珍型(0.3 mini, 0.3英寸)LED七段段碼顯示器)
中文描述: 七段顯示器超小型,微型0.3,0.3英寸(超袖珍型(0.3迷你,0.3英寸)的LED七段段碼顯示器)
文件頁數(shù): 1/2頁
文件大小: 27K
代理商: HDSP-UXXX
Seven Segment Displays—
Ultra mini, 0.3 mini, 0.3 inch
Reliability Data
Description
The following cumulative test
results have been obtained from
testing performed at Agilent
Optoelectronics Division in
accordance with the latest
revision of MIL- STD-883.
Agilent tests parts at the absolute
maximum rated conditions
recommended for the device. The
actual performance you obtain
from Agilent parts depends on the
electrical and environmental
characteristics of your application
Point Typical Performance
Total
Failed
MTBF
Stress Test
Conditions
Total Device
Hours
Units
Tested
Failure Rate
(%/1 K Hours)
Colors
Yellow
STD Red
Green
HER
T
A
= 55
°
C, I
F
= 20 mA
T
A
= 55
°
C, I
F
= 25 mA
T
A
= 55
°
C, I
F
= 30 mA
T
A
= 55
°
C, I
F
= 30 mA
10,500
147,000
399,000
399,000
21
21
63
63
0
0
0
0
10,500
147,000
399,000
399,000
0.95 %
0.68 %
0.25 %
0.25 %
Table 1. Life Tests
Demonstrated Performance
Failure Rate Prediction
The failure rate of semiconductor
devices is determined by the
junction temperature of the
device. The relationship between
ambient temperature and actual
junction temperature is given by
the following:
T
J
(
°
C) = T
A
(
°
C) +
θ
JA
P
AVG
where T
A
= ambient temperature
in
°
C
θ
JA
= thermal resistance of
junction-to-ambient in
°
C/watt
HDSP-Uxxx,
HDSP-Axxx, HDSP-3xxx,
HDSP-4xxx, HDSP-7xxx
but will probably be better than
the performance outlined in
Table 1.
P
AVG
= average power dissipated
in watts
The estimated MTBF and failure
rate at temperatures lower than
the actual stress temperature can
be determined by using an
Arrhenius model for temperature
acceleration. Results of such
calculations are shown in the
table below using an activation
energy of 0.43 eV (reference
MIL-HDBK-217).
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