
King Billion Electronics Co., Ltd
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HE83003
HE80000 SERIES
September 8, 2004
This specification is subject to change without notice. Please contact sales person for the latest version before use.
4
V1.1
Pin Name I/O
Description
PRTD[1..0] general I/O bi-direction pins.
PWMP/PWMN
O
The PWM output can drive speaker or buzzer directly. Using PWMP & PWMN to drive output
device.
VO
O Current DAC Output.
OPIN
I Inverting input of OP Amp.
OPIP
I Non-inverting input of OP Amp.
OPO
O Output of OP Amp.
P Positive power Input. A 0.1 μF decoupling capacitors should be placed as close to IC VDD
and GND pads as possible for best decoupling effect.
GND
P Power ground Input.
VDD
I: Input, O: Output, B: Bidirectional, P: Power.
5.
Oscillators
The MCU is equipped with two clock sources with a variety of selections on the types of oscillators to
choose from. System designer can select oscillator types based on the cost target, timing accuracy
requirements etc. Crystal, Resonator or the RC oscillator can be used as fast clock source, components
should be placed as close to the pins as possible. The type of oscillator used is selected by mask option
MO_FXTAL.
FXI (Bi-direction), FXO (Output)
Mask Option
Description
MO_FXTAL
0: RC Oscillator.
1: Crystal Oscillator.
0: Fast clock disable
1: Fast clock enable
MO_FCK
SXI (Bi-direction), SXO (Output)
Two types of oscillator, crystal and RC, can be used as slow clock selectable by mask option
MO_SXTAL. If used time keeping function or other applications that required the accurate timing, crystal
oscillator is recommended. If the timing accuracy is not important, then RC type oscillator can be used to
save cost.
VDD
FXI
FXO
FXI
R
C
X'tal
10P
10P