- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄383057 > HFA1130883 (Intersil Corporation) Output Clamping, 850MHz Current Feedback Amplifier PDF資料下載
參數(shù)資料
| 型號： | HFA1130883 |
| 廠商： | Intersil Corporation |
| 英文描述： | Output Clamping, 850MHz Current Feedback Amplifier |
| 中文描述： | 輸出鉗位，850MHz的電流反饋放大器 |
| 文件頁數(shù)： | 9/19頁 |
| 文件大?。?/td> | 865K |
| 代理商： | HFA1130883 |
212
HFA1130/883
Packaging
(Continued)
D
j x 45
o
D3
B
h x 45
o
A
A1
E
L
L3
e
B3
B1
L1
D2
D1
e
1
E2
E1
L2
PLANE 2
PLANE 1
E3
B2
NOTES:
1. Metallized castellations shall be connected to plane 1 terminals
and extend toward plane 2 across at least two layers of ceramic
or completely across all of the ceramic layers to make electrical
connection with the optional plane 2 terminals.
2. Unless otherwise specified, a minimum clearance of 0.015 inch
(0.381mm) shall be maintained between all metallized features
(e.g., lid, castellations, terminals, thermal pads, etc.)
3. Symbol “N” is the maximum number of terminals. Symbols “ND”
and “NE” are the number of terminals along the sides of length
“D” and “E”, respectively.
4. The required plane 1 terminals and optional plane 2 terminals
shall be ellectrically connected.
5. The corner shape (square, notch, radius, etc.) may vary at the
manufacturer’s option, from that shown on the drawing.
6. Chip carriers shall be constructed of a minimum of two ceramic
layers.
7. Maximum limits allows for 0.007 inch solder thickness on pads.
8. Lead Finish: Type A.
9. Materials: Compliant to MIL-I-38535.
J20.A
MIL-STD-1835 CQCC1-N20 (C-2)
20 PAD METAL SEAL LEADLESS CERAMIC CHIP CARRIER
SYMBOL
A
A1
B
B1
B2
B3
D
D1
D2
D3
E
E1
E2
E3
e
e1
h
j
L
L1
L2
L3
ND
NE
N
INCHES
MIN
0.060
0.050
-
0.022
0.072 REF
0.006
0.342
0.200 BSC
0.100 BSC
-
0.342
0.200 BSC
0.100 BSC
-
0.050 BSC
0.015
0.040 REF
0.020 REF
0.045
0.045
0.075
0.003
MILLIMETERS
MIN
1.52
1.27
-
0.56
1.83 REF
0.15
8.69
5.08 BSC
2.54 BSC
-
8.69
5.08 BSC
2.54 BSC
-
1.27 BSC
0.38
1.02 REF
0.51 REF
1.14
1.14
1.90
0.08
5
5
20
NOTES
6, 7
7
4
2, 4
-
-
-
-
-
2
-
-
-
2
-
2
5
5
-
-
-
-
3
3
3
MAX
0.100
0.088
-
0.028
MAX
2.54
2.23
-
0.71
0.022
0.358
0.56
9.09
0.358
0.358
9.09
9.09
0.358
9.09
-
-
0.055
0.055
0.095
0.015
1.40
1.40
2.41
0.38
5
5
20
Spec Number
511082-883
相關PDF資料 |
PDF描述 |
|---|---|
| HFA1130IB | CAPACITOR 1500UF 200V ELECT TSUP |
| HFA1130IP | 850MHz, Output Limiting, Low Distortion Current Feedback Operational Amplifier |
| HFA1130EVAL | 850MHz, Output Limiting, Low Distortion Current Feedback Operational Amplifier |
| HGTD1N120BNS | 5.3A, 1200V, NPT Series N-Channel IGBT |
| HGTD1N120CNS | 6.2A, 1200V, NPT Series N-Channel IGBT |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| HFA1130EVAL | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:850MHz, Output Limiting, Low Distortion Current Feedback Operational Amplifier |
| HFA1130IB | 功能描述:運算放大器 - 運放 800 MHz Output Limit RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉換速度:0.89 V/us 關閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| HFA1130IB96 | 功能描述:IC BUFFER CFA 850MHZ 8-SOIC RoHS:否 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:50 系列:LinCMOS™ 放大器類型:通用 電路數(shù):4 輸出類型:- 轉換速率:0.05 V/µs 增益帶寬積:110kHz -3db帶寬:- 電流 - 輸入偏壓:0.7pA 電壓 - 輸入偏移:210µV 電流 - 電源:57µA 電流 - 輸出 / 通道:30mA 電壓 - 電源，單路/雙路(±):3 V ~ 16 V，±1.5 V ~ 8 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:14-SOIC 包裝:管件 產(chǎn)品目錄頁面:865 (CN2011-ZH PDF) 其它名稱:296-1834296-1834-5 |
| HFA1130IBZ | 功能描述:運算放大器 - 運放 W/ANL OPAMP 850MHZ CFB CLMP IND RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉換速度:0.89 V/us 關閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| HFA1130IBZ | 制造商:Intersil Corporation 功能描述:Operational Amplifier (Op-Amp) IC |
發(fā)布緊急采購，3分鐘左右您將得到回復。