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參數(shù)資料
| 型號(hào)： | HFA1130IBZ-T |
| 廠商： | Intersil |
| 文件頁(yè)數(shù)： | 5/13頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC BUFFER CFA 850MHZ 8-SOIC |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 放大器類(lèi)型： | 電流反饋 |
| 電路數(shù)： | 1 |
| 轉(zhuǎn)換速率： | 2300 V/µs |
| -3db帶寬： | 850MHz |
| 電流 - 輸入偏壓： | 25µA |
| 電壓 - 輸入偏移： | 2000µV |
| 電流 - 電源： | 21mA |
| 電流 - 輸出 / 通道： | 60mA |
| 電壓 - 電源，單路/雙路(±)： | ±4.5 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SOIC |
| 包裝： | 帶卷 (TR) |
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13
FN3369.5
April 25, 2013
HFA1130
Package Outline Drawing
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
DETAIL "A"
TOP VIEW
INDEX
AREA
12
3
-C-
SEATING PLANE
x 45°
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
SIDE VIEW “A
SIDE VIEW “B”
1.27 (0.050)
6.20 (0.244)
5.80 (0.228)
4.00 (0.157)
3.80 (0.150)
0.50 (0.20)
0.25 (0.01)
5.00 (0.197)
4.80 (0.189)
1.75 (0.069)
1.35 (0.053)
0.25(0.010)
0.10(0.004)
0.51(0.020)
0.33(0.013)
8°
0°
0.25 (0.010)
0.19 (0.008)
1.27 (0.050)
0.40 (0.016)
1.27 (0.050)
5.20(0.205)
1
2
3
4
5
6
7
8
TYPICAL RECOMMENDED LAND PATTERN
2.20 (0.087)
0.60 (0.023)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HFA1130IJ | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HFA1130IP | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HFA-1130IP | 制造商:Harris Corporation 功能描述: |
| HFA1130MJ/883 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HFA1130ML/883 | 制造商:INTERSIL 制造商全稱(chēng):Intersil Corporation 功能描述:Output Clamping, 850MHz Current Feedback Amplifier |
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