參數(shù)資料
型號(hào)： HFBR-5203T
英文描述： 800 nm 300 m，ATM Multimode Fiber Transceivers for SONET OC-3/SDH STM-1 in Low Cost 1x9 Package Style(800 nm 300 m，應(yīng)用于SONET OC-3/SDH STM-1的ATM多模式光收發(fā)器（低價(jià)格1x9 封裝類型）)
中文描述： 800納米300米，自動(dòng)取款機(jī)多模光纖收發(fā)器用于SONET OC-3/SDH掃描隧道顯微鏡在低成本1x9包裝樣式1（800納米300米，應(yīng)用于SONET的OC-3/SDH的STM - 1的自動(dòng)柜員機(jī)多模式光收發(fā)器（低價(jià)格1x9封裝類型））
文件頁(yè)數(shù)： 7/20頁(yè)
文件大小： 326K
代理商： HFBR-5203T
7
NO INTERNAL CONNECTION
NO INTERNAL CONNECTION
HFBR-520X
TOP VIEW
V
EE
1
RD
2
RD
3
SD
4
V
CC
5
V
CC
6
TD
7
TD
8
V
EE
9
C1
C2
L1
L2
R2
R3
R1
R4
C5
C3
C4
R9
R10
V
FILTER
AT V
PINS
TRANSCEIVER
R5
R7
R6
R8
C6
RD
RD
SD
V
CC
TD
TD
TERMINATION
AT PHY
DEVICE
INPUTS
NOTES:
THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT
OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT
BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED.
R1 = R4 = R6 = R8 = R10 = 130 OHMS.
R2 = R3 = R5 = R7 = R9 = 82 OHMS.
C1 = C2 = C3 = C5 = C6 = 0.1 μF.
C4 = 10 μF.
L1 = L2 = 1 μH COIL OR FERRITE INDUCTOR.
TERMINATION
AT TRANSCEIVER
INPUTS
Rx
Rx
Tx
Tx
V
CC
V
CC
protect it from mechanical and
ESD damage during shipment or
storage.
Board Layout - Decoupling
Circuit and Ground Planes
It is important to take care in the
layout of your circuit board to
achieve optimum performance
from these transceivers. Figure 7
provides a good example of a
schematic for a power supply
decoupling circuit that works well
with these parts. It is further
recommended that a contiguous
ground plane be provided in the
circuit board directly under the
transceiver to provide a low
inductance ground for signal
return current. This recommen-
dation is in keeping with good
high frequency board layout
practices.
Board Layout - Hole Pattern
The Agilent transceiver complies
with the circuit board “Common
Transceiver Footprint” hole
pattern defined in the original
multisource announcement which
defined the 1x9 package style.
This drawing is reproduced in
Figure 8 with the addition of ANSI
Y14.5M compliant dimensioning
to be used as a guide in the
mechanical layout of your circuit
board.
Figure 7. Recommended Decoupling and Termination Circuits.
相關(guān)PDF資料
PDF描述
HFBR-5203 800 nm 300 m，ATM Multimode Fiber Transceivers for SONET OC-3/SDH STM-1 in Low Cost 1x9 Package Style(800 nm 300 m，應(yīng)用于SONET OC-3/SDH STM-1的ATM多模式光收發(fā)器（低價(jià)格1x9 封裝類型）)
HFBR-5204T 1300 nm 1x9 Transceiver(1300 nm 1x9 收發(fā)器)
HFBR-5105 1300nm 500 m，F(xiàn)DDI, 100 Mbps ATM, and Fast Ethernet Transceivers in Low Cost 1x9 Package Style(1300nm 500 m，F(xiàn)DDI, 100 Mbps ATM, 快速以太網(wǎng)收發(fā)器（低價(jià)格 1x9 封裝類型）)
HFBR-5204 1300 nm 1x9 Transceiver(1300 nm 1x9 收發(fā)器)
HFBR-5301 1300 nm 1x9 Transceiver(1300 nm 1x9 收發(fā)器)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HFBR5204 制造商:Avago Technologies 功能描述:
HFBR-5204 制造商:AGILENT 制造商全稱:AGILENT 功能描述:ATM Multimode Fiber Transceivers for SONET OC-3/SDH STM-1 in Low Cost 1x9 Package Style
HFBR-5204E 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Telecommunication IC
HFBR-5204F 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Telecommunication IC
HFBR-5204P 制造商:未知廠家 制造商全稱:未知廠家 功能描述:ATM MMF Transceivers for SONET OC-3/SDH STM-1 in 1x9 Package: SC. Mezz. Height
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